Customer Support: +44 (0)203 327 3140

Login to i2i Subscription Intertek.com
  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Go to AMERICAS site
Dismiss alert
Please enter a keyword to search
Advanced search
Home
Publishers
CENELEC
EN 61191-4:2017

EN 61191-4:2017

Current

Current

The latest, up-to-date edition.

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Published date

27-10-2017

Publisher

European Committee for Standards - Electrical

Sorry this product is not available in your region.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 General terminal and part mounting requirements
6 Acceptance requirements
7 Rework of unsatisfactory soldered connections
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).This edition includes the following significant technical changes with respect to the previous edition:The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Terminal assemblies
OVE/ONORM EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
I.S. EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
BS EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 62326-1:2002 Printed boards - Part 1: Generic specification
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0 TEST METHODS MANUAL
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
ISO 9001:2015 Quality management systems — Requirements
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC SM 817 : A GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

or

Get in touch with us