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EN 61191-4:2017

EN 61191-4:2017

Current

Current

The latest, up-to-date edition.

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Published date

10-27-2017

Publisher

European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 General terminal and part mounting requirements
6 Acceptance requirements
7 Rework of unsatisfactory soldered connections
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).This edition includes the following significant technical changes with respect to the previous edition:The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Terminal assemblies
OVE/ONORM EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
I.S. EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
BS EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 62326-1:2002 Printed boards - Part 1: Generic specification
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0 TEST METHODS MANUAL
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
ISO 9001:2015 Quality management systems — Requirements
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC SM 817 : A GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)

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