IPC J STD 004 : B
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
REQUIREMENTS FOR SOLDERING FLUXES
Amended by
Available format(s)
PDF
Language(s)
Chinese, English
Publisher
Superseded date
07-05-2026
Superseded by
Excluding VAT
1 SCOPE AND DESIGNATION
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 QUALIFICATIONS AND QUALITY ASSURANCE PROVISIONS
Appendix A - Example Qualification Test Report
Appendix B - Notes
Describes general requirements for the classification and characterization of fluxes for high quality solder interconnections.
| DevelopmentNote |
Supersedes QQ S 571, MIL F 14256, IPC SF 818, QPL 14256, QPL QQ S 571 & DEFSTAN 34-4/2(1990). Included in IPC C 103 & IPC C 1000. (04/2006) A2004 Edition is available in Japanese Language, See J STD 004 JAPANESE. B2008 Edition Re-Issued in November 2011 & incorporates AMD 1 2011. Also available in Chinese & Russian languages, See J STD 004 CHINESE & J STD 004 RUSSIAN. (11/2012)
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| DocumentType |
Standard
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| Pages |
32
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
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| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
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| MIL-DTL-28754-11 Revision F:2014 | Connectors, Electrical, Modular, Type IV, 40 Contact, Right Angle (for Solid or Dip Frame) |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| MIL-DTL-21617 Revision B:2012 | Connectors, Plug and Receptacle, Electrical, Rectangular, Polarized Shell, Miniature Type General Specification for |
| MIL-DTL-28754-100 Revision A:2015 | Connectors, Electrical, Modular, Type IV, Connector, 200 Contact, Center |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| DSCC 99002 : A | TRANSFORMER, SWITCHING |
| SAE AMSP81728B | Plating, Tin-Lead (Electrodeposited) |
| MS90908 Revision C:2011 | Filler Tube, Fuel Tank-Military Vehicles |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| I.S. EN 3155-041:2007 | AEROSPACE SERIES - ELECTRICAL CONTACTS USED IN ELEMENTS OF CONNECTION - PART 041: CONTACTS, ELECTRICAL, COAXIAL, SIZE 12, FEMALE, TYPE D, SOLDER, CLASS R - PRODUCT STANDARD |
| EN 3155-039:2007 | Aerospace series - Electrical contacts used in elements of connection - Part 039: Contacts, electrical, coaxial, size 16, female, type D, solder, class R - Product standard |
| IPC TP 104 : 1992 | CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 3, WATER SOLUBLE FLUXES, PARTS 1 AND 2 |
| MIL-STD-883-1:2019+CHANGE 2:2024 | Environmental Test Methods for Microcircuits Part 1: Test Methods 1000-1999 |
| IPC LDFR0405-CD : 2005 | IPC/JEDEC 8TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES |
| IPC TP 1043 : 1992 | CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 1 |
| IPC M 104 : LATEST | STANDARDS FOR PRINTED BOARD ASSEMBLY MANUAL |
| IPC TP 1044 : 1992 | CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 2 |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| ISO/TS 16949:2009 | Quality management systems — Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations |
| EN 14582:2016 | Characterization of waste - Halogen and sulfur content - Oxygen combustion in closed systems and determination methods |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| ANSI/NCSL Z540 1 : 94(R2002) | CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS |
| ISO 9455-17:2002 | Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
| GR 78 CORE : ISSUE 2 | GENERIC REQUIREMENTS FOR THE PHYSICAL DESIGN AND MANUFACTURE OF TELECOMMUNICATIONS PRODUCTS AND EQUIPMENT |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| ISO 9001:2015 | Quality management systems — Requirements |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
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