IPC J STD 002 : D

1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 TEST PROCEDURES
5 NOTES
APPENDIX A - Critical Component Surfaces
APPENDIX B - Evaluation Aids
APPENDIX C - Calculation of Maximum
             Theoretical Force
APPENDIX D - Calculation of Integrated Value
             of Area of the Wetting Curve
APPENDIX E - Informative Annex
APPENDIX F - J-STD-002/J-STD-003 Activated
             Solderability Test Flux Rationale
             Committee Letter
APPENDIX G - Graphical Representations:
             Progression of Solder Wetting
             Curve Parameters As Measured
             By Wetting Balance Testing
APPENDIX H - Test Protocol for Wetting

Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.