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IPC TR 465 1 : 1993

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY

Withdrawn date

13-09-2023

Published date

23-11-2012

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Covers test data from 7 companies using 13 different models of steam agers. It was the intent of the program to evaluate the variability of steam aging equipment, and to develop a test procedure to quantify this variability so that it may be controlled. Concludes that the test procedure developed was effective in quantifying steam ager temperature variability. Also concluded was that most agers were capable of maintaining a temperature tolerance of +/- 3 degrees Celsius. The report recommends that his limit be made a requirement in industry specifications.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn

IPC TR 461 : 1979 SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
IPC TR 466 : 1995 TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST
IPC TR 465 2 : 1993 THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
IPC TR 464 : 0 ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS

IPC TR 464 : 0 ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS
IPC TR 465 3 : - EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A
IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
IPC TR 465 2 : 1993 THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC TR 466 : 1995 TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST

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