SN EN ISO 9455-17 : 2006
Current
The latest, up-to-date edition.
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
01-12-2013
Foreword
1 Scope
2 Normative references
3 Principle
4 Reagents
5 Apparatus
6 Inspection of test coupons
7 Sample preparation
8 Procedure
9 Assessment
10 Precision
11 Test report
Annex A (informative) SIR testing guidance
Annex B (informative) Surface insulation resistance comb
test and electrochemical migration test of flux
residues - Qualification test report
Bibliography
Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.
| DocumentType |
Standard
|
| PublisherName |
Swiss Standards
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN ISO 9455-17:2006 | Identical |
| EN ISO 9455-17:2006 | Identical |
| NS EN ISO 9455-17 : 1ED 2006 | Identical |
| UNE-EN ISO 9455-17:2007 | Identical |
| UNI EN ISO 9455-17 : 2007 | Identical |
| ISO 9455-17:2002 | Identical |
| DIN EN ISO 9455-17:2006-09 | Identical |
| BS EN ISO 9455-17:2006 | Identical |
| ONORM EN ISO 9455-17 : 2006 | Identical |
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