SN EN 61192-3 : 2003
Current
The latest, up-to-date edition.
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
01-12-2013
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection techniques
4.4 Interpretation of requirements
5 Component preparation processes
5.1 Lead forming
5.2 Lead protrusion and clinching
5.3 Lead cutting/cropping
5.4 Pre-tinning
6 Masking attributes
6.1 Misalignment
6.2 Improper adhesion
6.3 Thermal capability
7 Insertion of through-hole components
7.1 General requirements
7.2 Orientation and mounting criteria
7.3 Missing components
7.4 Wrong components
7.5 Damaged components
8 Soldering process attributes
8.1 General requirements
8.2 Misalignment
8.3 Damaged components
8.4 Solder joint characteristics
9 Cleaning attributes
9.1 Flux residues
9.2 Other residues
10 Rework/replacement attributes
Annex ZA (normative) Normative references to international
publications with their corresponding European publications
Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
| DocumentType |
Standard
|
| PublisherName |
Swiss Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 61192-3:2003-10 | Identical |
| I.S. EN 61192-3:2003 | Identical |
| IEC 61192-3:2002 | Identical |
| BS EN 61192-3:2003 | Identical |
| EN 61192-3:2003 | Identical |
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