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SN EN 61191-1 : 1998

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

View Superseded by

PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION: REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES

Withdrawn date

06-25-2016

Superseded by

SN EN 61191-1:2013

Published date

01-12-2013

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Contents
Clause
1. Scope
2. Normative references
3. Terms and definitions
4. General requirements
    4.1 Order of precedence
    4.2 Interpretation of requirements
    4.3 Classification
    4.4 Defects and process deviation indicators (PDIs)
    4.5 Process control requirements
    4.6 Requirements flowdown
    4.7 Physical designs
    4.8 Visual aids
    4.9 Proficiency of personnel
    4.10 Electrostatic discharge (ESD)
    4.11 Facilities
    4.12 Assembly tools and equipment
5. Materials requirements
    5.1 Solder
    5.2 Flux
    5.3 Solder paste
    5.4 Preform solder
    5.5 Adhesives
    5.6 Cleaning agents
    5.7 Polymeric coatings
    5.8 Chemical strippers
    5.9 Heat shrinkable soldering devices
6. Components and printed board requirements
    6.1 Solderability
    6.2 Solderability maintenance
    6.3 Solder purity maintenance
    6.4 Lead preparation
7. Assembly process requirements
    7.1 Cleanliness
    7.2 Part markings and reference designations
    7.3 Solder connection contours
    7.4 Moisture traps
    7.5 Thermal dissipation
8. Assembly soldering requirements
    8.1 General
    8.2 Reflow soldering
    8.3 Mechanized immersion soldering (non-reflow)
    8.4 Manual/hand soldering
9. Cleanliness requirements
    9.1 Equipment and material compatibility
    9.2 Pre-soldering cleaning
    9.3 Post-soldering cleaning
    9.4 Cleanliness verification
    9.5 Cleanliness criteria
10. Assembly requirements
    10.1 Acceptance requirements
    10.2 General assembly requirements
11. Coating and encapsulation
    11.1 Conformal coating
    11.2 Encapsulation
12. Rework and repair
    12.1 Rework of unsatisfactory soldered electrical and
         electronic assemblies
    12.2 Repair
    12.3 Post rework/repair cleaning
13. Product quality assurance
    13.1 Inspection methodology
    13.2 Process control
14. Other requirements
    14.1 Health and safety
    14.2 Special manufacturing requirements
    14.3 Guidance on requirement flowdown
Annexes
A Requirements for soldering tools and equipment
B Qualification of fluxes
C Quality assessment
D Bibliography
ZA Normative references to international publications with
their corresponding European publications

Gives requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies that use surface mounted and relating assembly technologies. Included also, are recommendations for good manufacturing processes.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Withdrawn
SupersededBy

Standards Relationship
BS EN 61191-1:2013 Identical
DIN EN 61191-1:2015-10 (Draft) Identical
IEC 61191-1:2013 Identical
I.S. EN 61191-1:2013 Identical
EN 61191-1:2013 Identical
NBN EN 61191-1 : 2013 Identical
NF EN 61191-1 : 2014 Identical

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