SEMI M49 : 2016
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS
Superseded date
11-06-2016
Superseded by
Published date
01-12-2013
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Specifies recommendations for specifying measurement systems for geometry and flatness of silicon wafers of the 130, 90, 65, 45, 32, 22, and 16 nm technology generation as anticipated by the International Technology Roadmap for Semiconductors (ITRS) and in the forecasts of the major manufacturers of semiconductor devices.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (11/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Superseded
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| SupersededBy |
| SEMI M70 : 2015 | TEST METHOD FOR DETERMINING WAFER-NEAR-EDGE GEOMETRY USING PARTIAL WAFER SITE FLATNESS |
| SEMI M1 : 2017 | SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS |
| SEMI 3D4 : 2015 | GUIDE FOR METROLOGY FOR MEASURING THICKNESS, TOTAL THICKNESS VARIATION (TTV), BOW, WARP/SORI, AND FLATNESS OF BONDED WAFER STACKS |
| SEMI M78 : 2010 | GUIDE FOR DETERMINING NANOTOPOGRAPHY OF UNPATTERNED SILICON WAFERS FOR THE 130 NM TO 22 NM GENERATIONS IN HIGH VOLUME MANUFACTURING |
| SEMI MF84:2012 | TEST METHOD FOR MEASURING RESISTIVITY OF SILICON WAFERS WITH AN IN-LINE FOUR-POINT PROBE |
| SEMI E10 : 2014E | SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT RELIABILITY, AVAILABILITY, AND MAINTAINABILITY (RAM) AND UTILIZATION |
| SEMI E159 : 2014 | MECHANICAL SPECIFICATION FOR MULTI APPLICATION CARRIER (MAC) USED TO TRANSPORT AND SHIP 450 MM WAFERS |
| SEMI E1-9 : NOV 2006E | MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 MM WAFERS |
| SEMI E19 : APR 2017 | SPECIFICATION FOR STANDARD MECHANICAL INTERFACE (SMIF) |
| SEMI M59 : 2014 | TERMINOLOGY FOR SILICON TECHNOLOGY |
| SEMI MF42 : 2016 | TEST METHOD FOR CONDUCTIVITY TYPE OF EXTRINSIC SEMICONDUCTING MATERIALS |
| SEMI MF928 : 2017 | TEST METHOD FOR EDGE CONTOUR OF CIRCULAR SEMICONDUCTOR WAFERS AND RIGID DISK SUBSTRATES |
| SEMI MF1530 : 2007(R2018) | TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
| SEMI MF534 : 2007 | TEST METHOD FOR BOW OF SILICON WAFERS |
| SEMI E89 : 2007(R2013) | GUIDE FOR MEASUREMENT SYSTEM ANALYSIS (MSA) |
| SEMI MF1451:2007(R2019) | TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
| SEMI MF2074 : 2012 (R2018) | GUIDE FOR MEASURING DIAMETER OF SILICON AND OTHER SEMICONDUCTOR WAFERS |
| SEMI M31 : 2008 | MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS |
| SEMI M24 : 2007 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS |
| SEMI E158 : 2014 | MECHANICAL SPECIFICATION FOR FAB WAFER CARRIER USED TO TRANSPORT AND STORE 450 MM WAFERS (450 FOUP) AND KINEMATIC COUPLING |
| SEMI MF1152 : 2016 | TEST METHOD FOR DIMENSIONS OF NOTCHES ON SILICON WAFERS |
| SEMI M67 : 2015 | TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD, AND ESBIR METRICS |
| SEMI M8 : 2012 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS |
| SEMI MF673 : 2017 | TEST METHOD FOR MEASURING RESISTIVITY OF SEMICONDUCTOR WAFERS OR SHEET RESISTANCE OF SEMICONDUCTOR FILMS WITH A NONCONTACT EDDY-CURRENT GAUGE |
| SEMI E37 : 2013 | HIGH-SPEED SECS MESSAGE SERVICES (HSMS) GENERIC SERVICES |
| SEMI MF657 : 2007E | TEST METHOD FOR MEASURING WARP AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY NONCONTRAST SCANNING |
| SEMI E47.1 : NOV 2006 | MECHANICAL SPECIFICATION FOR FOUPS USED TO TRANSPORT AND STORE 300 MM WAFERS |
| SEMI M62 : 2017 | SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS |
| SEMI M80 : 2016 | SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 450 MM WAFERS |
| SEMI E47 : 2001(R2006) | SPECIFICATION FOR 150 MM/200 MM POD HANDLES |
| SEMI T7 : 2016 | SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL |
| SEMI M38 : 2012(R2018) | SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS |
| SEMI M73 : 2013 | TEST METHODS FOR EXTRACTING RELEVANT CHARACTERISTICS FROM MEASURED WAFER EDGE PROFILES |
| SEMI E58 : JUL 2003 | AUTOMATED RELIABILITY, AVAILABILITY, AND MAINTAINABILITY STANDARD (ARAMS): CONCEPTS, BEHAVIOR, AND SERVICES |
| SEMI M68 : MAR 2015 | TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDD |
| SEMI MF671:2012 | TEST METHOD FOR MEASURING FLAT LENGTH ON WAFERS OF SILICON AND OTHER ELECTRONIC MATERIALS |
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