SEMI E10 : 2014E
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT RELIABILITY, AVAILABILITY, AND MAINTAINABILITY (RAM) AND UTILIZATION
03-08-2021
01-12-2013
Sets up a common basis for communication between users and suppliers of semiconductor manufacturing equipment by providing a standardized methodology for measuring reliability, availability, and maintainability (RAM) and utilization performance of equipment in a manufacturing environment.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001) E = This standard was editorially modified in November 2015 to correct editorial errors. (12/2015)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Superseded
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| SupersededBy |
| SEMI E81 : 2000(R2007) | PROVISIONAL SPECIFICATION FOR CIM FRAMEWORK DOMAIN ARCHITECTURE |
| SEMI E58 : JUL 2003 | AUTOMATED RELIABILITY, AVAILABILITY, AND MAINTAINABILITY STANDARD (ARAMS): CONCEPTS, BEHAVIOR, AND SERVICES |
| SEMI E116 : 2017 | SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING |
| SEMI E104 : 2003 | SPECIFICATION FOR INTEGRATION AND GUIDELINE FOR CALIBRATION OF LOW-PRESSURE PARTICLE MONITOR |
| SEMI S23 : 2016 | GUIDE FOR CONSERVATION OF ENERGY, UTILITIES AND MATERIALS USED BY SEMICONDUCTOR MANUFACTURING EQUIPMENT |
| SEMI E106 : 2004 | OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS |
| SEMI E79 : 2014E | SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT PRODUCTIVITY |
| SEMI E97 : 2000A(R2007) | PROVISIONAL SPECIFICATION FOR CIM FRAMEWORK GLOBAL DECLARATIONS AND ABSTRACT INTERFACES |
| SEMI E98 : 2009 | PROVISIONAL STANDARD FOR THE OBJECT-BASED EQUIPMENT MODEL (OBEM) |
| SEMI G78 : 1999 | TEST METHOD FOR COMPARING AUTOMATED WAFER PROBE SYSTEMS UTILIZING PROCESS-SPECIFIC MEASUREMENTS |
| SEMI E149 : 2014 | GUIDE FOR EQUIPMENT SUPPLIER-PROVIDED DOCUMENTATION FOR THE ACQUISITION AND USE OF MANUFACTURING EQUIPMENT |
| SEMI E124 : 2007(R2013) | GUIDE FOR DEFINITION AND CALCULATION OF OVERALL FACTORY EFFICIENCY (OFE) AND OTHER ASSOCIATED FACTORY-LEVEL PRODUCTIVITY METRICS |
| SEMI PV2 : 2009E | GUIDE FOR PV EQUIPMENT COMMUNICATION INTERFACES (PVECI) |
| SEMI S14 : 2016 | SAFETY GUIDELINES FOR FIRE RISK ASSESSMENT AND MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT |
| SEMI E70 : 2013 | GUIDE FOR TOOL ACCOMMODATION PROCESS |
| SEMI E35 : 2012 | GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT |
| IEEE 1100 : 2005 | POWERING AND GROUNDING ELECTRONIC EQUIPMENT |
| SEMI E150 : 2014 | GUIDE FOR EQUIPMENT TRAINING BEST PRACTICES |
| SEMI M49 : 2016 | GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS |
| SEMI P24 : 1994(R2004) | CD METROLOGY PROCEDURES |
| SEMI M52 : 2014 | GUIDE FOR SPECIFYING SCANNING SURFACE INSPECTION SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 11 NM TECHNOLOGY GENERATIONS |
| SEMI E113 : 2006(R2018) | SPECIFICATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT RF POWER DELIVERY SYSTEMS |
| SEMI E30.2 : 1998 | HANDLER EQUIPMENT SPECIFIC EQUIPMENT MODEL (HSEM) |
| SEMI E116 : 2017 | SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING |
| SEMI E35 : 2012 | GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT |
| SEMI E79 : 2014E | SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT PRODUCTIVITY |
| SEMI E58 : JUL 2003 | AUTOMATED RELIABILITY, AVAILABILITY, AND MAINTAINABILITY STANDARD (ARAMS): CONCEPTS, BEHAVIOR, AND SERVICES |
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