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SAE ARP 1612 : 2014

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

POLYIMIDE PRINTED CIRCUIT BOARDS, FABRICATION OF

Available format(s)

Hardcopy , PDF

Superseded date

06-14-2022

Superseded by

SAE ARP1612A

Language(s)

English

Published date

08-14-2014

US$130.98
Excluding Tax where applicable

1. SCOPE
2. APPLICABLE DOCUMENTS
3. GENERAL
4. PROCESS RECOMMENDATIONS
5. MULTILAYER PRINTED WIRING BOARD
    FABRICATION CYCLE
6. DOUBLE-SIDED PRINTED WIRING BOARD
    FABRICATION CYCLE
7. QUALITY ACCEPTANCE REQUIREMENTS, POLYIMIDE
    PRINTED WIRING BOARDS
8. APPROVAL
9. SAFETY
10. REFERENCE DOCUMENTS
11. NOTES

This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards.

Committee
AMS-P17
DocumentType
Standard
Pages
18
PublisherName
SAE International
Status
Superseded
SupersededBy
Supersedes

GEIA TA HB 0009 : 2013 RELIABILITY PROGRAM HANDBOOK

MIL P 13949/10 : B PLASTIC SHEET, LAMINATED, METAL CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GI, GLASS BASE, WOVEN, POLYIMIDE RESIN, HEAT RESISTANT, COPPER CLAD
A-A-113 Revision D:1996 TAPE PRESSURE-SENSITIVE ADHESIVE
MIL-STD-275 Revision E:1984 PRINTED WIRING - ELECTRONIC EQUIPMENT
MIL P 13949/13 : A PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), GI BASE MATERIAL, GLASS FABRIC WOVEN, POLYIMIDE RESIN PREIMPREGNATED (B-STAGE)
FED-STD-406 Revision A:1982 PLASTIC, METHODS OF TESTING
SAE AMS2350BA Standards and Test Methods
MIL B 22191 : D BARRIER MATERIAL, TRANSPARENT, FLEXIBLE, HEAT SEALABLE
MIL-F-14256 Revision F:1993 FLUX, SOLDERING, LIQUID (ROSIN BASE)
MIL-P-81728 Revision A:1973 PLATING, TIN LEAD, (ELECTRODEPOSITED)
MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
MIL P 55110 : LATEST PRINTED WIRING BOARD, RIGID GENERAL SPECIFICATION FOR

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