PN EN 60068-2-83 : 2011
Current
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
Published date
01-12-2013
Publisher
Sorry this product is not available in your region.
Gives the methods for comparative investigation of the wettability of the metallic terminations or metalized terminations of SMDs with solder pastes.
| Committee |
TC 293
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60068-2-83:2011 | Identical |
| EN 60068-2-83 : 2011 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.