PD IEC/TS 62647-1:2012
Current
The latest, up-to-date edition.
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
Hardcopy , PDF
English
11-30-2012
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols and abbreviated terms
5 Objectives
6 Technical requirements
7 Plan administrative requirements
Annex A (informative) - Template for tailoring
requirements of IEC/TS 62647-1
Annex B (informative) - Requirements matrix
for IEC/TS 62647-1
Annex C (informative) - Guidance on configuration
control and product identification
Bibliography
Specifies the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
Committee |
GEL/107
|
DevelopmentNote |
Supersedes BS PD IEC PAS 62647-1. (11/2012)
|
DocumentType |
Standard
|
Pages |
36
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that A DHP electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
This specification aims to communicate requirements for a lead-free control plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan owners in the development of their own Plans. The Plan documents the Plan owner’s processes to assure their customers and all other stakeholders that the Plan owner’s products will continue to meet their requirements, given the risks stated in the Introduction.
This specification does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the A DHP industries that need to be addressed by the processes.
Pb-free risk management should be accomplished through specific requirements added to the Plan owner’s existing infrastructure of product management and control.
This specification applies to the ADHP electronics system supply chain.
The control of the Pb-free activities will b e accomplished by the Plan owner addressing the requirements of their Customer. Th ese activities include, but are not limited to, those performed by the s ystem i ntegrator, the original equipment manufacturer (OEM), and their respective supply chains, to the lowest level possible. This should be done with the knowledge that, at the component level, the aerospace industry may not have a great influence over those suppliers. In such cases, the Plan owner assumes responsibility.
Some applications may have unique requirements that exceed the scope of this specification . The extended scope should be covered separately.
The requirements of this specification may be tailored to address unique/specific program needs. If tailoring is performed, the user will obtain documented customer concurrence. Annex A provides a tailoring template that may be used.
This document may be used by other high-performance and high-reliability industries, at their discretion.
Standards | Relationship |
IEC TS 62647-1:2012 | Identical |
DEFSTAN 08-107/3(2013) : 2013 | GENERAL REQUIREMENTS FOR THE DESIGN OF ELECTROTECHNICAL AND NAVAL WEAPON EQUIPMENT |
IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IEC PAS 62647-2:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin |
GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
IPC WP 006 : 2003 | ROUND ROBIN TESTING AND ANALYSIS - LEAD-FREE ALLOYS - TIN, SILVER AND COPPER |
GEIA STD 0005-3 : 2013 | PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
IEC PAS 62647-3:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
GEIA HB 649 : 2005 | CONFIGURATION MANAGEMENT STANDARD IMPLEMENTATION GUIDE |
IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 2225 : 0 | SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
IPC 1065 : 0 | MATERIAL DECLARATION HANDBOOK |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
IEC PAS 62647-21:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
IPC 6013 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
IPC 6015 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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