PD IEC/TS 62239-1:2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan
Hardcopy , PDF
12-13-2018
English
04-30-2015
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirements
5 Plan administration requirements
Annex A (informative) - Requirement matrix for IEC TS
62239-1
Annex B (informative) - Typical qualification requirements
and typical component minimum qualification
requirements
Annex C (informative) - Semiconductor reliability and
wear out
Annex D (informative) - Guidelines for environmental
protection techniques and for comparison of
components specifications
Bibliography
Specifies the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements.
| Committee |
GEL/107
|
| DevelopmentNote |
Supersedes DD IEC/TS 62239. (08/2012)
|
| DocumentType |
Standard
|
| Pages |
82
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
This part of IEC62239 , which is a technical specification, defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause4 are accomplished. In general, the plan owner of a complete Electronic Components Management Plan is the avionics original equipment manufacturer (OEM). This document provides an aid in the aerospace certification process. Although developed for the avionics industry, this process may be applied by other industrial sectors.
| Standards | Relationship |
| IEC TS 62239-1:2015 | Identical |
| SAE AS 5553B : 2016 | COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| GEIA STD 0005-3 : 2013 | PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| IECQ 001003:1998 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - GUIDANCE DOCUMENTS |
| IEC 61967-1:2002 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| ISO/TS 16949:2009 | Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations |
| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
| RTCA DO 254 : 2000 | DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE |
| SAE J 1752/3 : 2011 | MEASUREMENT OF RADIATED EMISSIONS FROM INTEGRATED CIRCUITS - TEM/WIDEBAND TEM (GTEM) CELL METHOD; TEM CELL (150 KHZ TO 1 GHZ), WIDEBAND TEM CELL (150 KHZ TO 8 GHZ) |
| IEC TR 62240-1:2013 | Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IECQ 01:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES |
| IECQ 001004:2006 | |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| SAE AS 9000 APPENDIX 1 : 1998 | AS 9000 AUDIT SUMMARY AND SUPPLIER PROFILE INSTRUCTIONS |
| IEC TS 62647-3:2014 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| IEC 62396-4:2013 | Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| ISO 9004:2009 | Managing for the sustained success of an organization A quality management approach |
| MIL-HDBK-263 Revision B:1994 | ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IECQ 03-4:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT |
| GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 62396-5:2014 | Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems |
| IEC 62396-3:2013 | Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation |
| ISO 9001:2015 | Quality management systems — Requirements |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| SAE AS 6496 : 2014 | FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - AUTHORIZED/FRANCHISED DISTRIBUTION |
| AIAA R 100 : A 2001 | RECOMMENDED PRACTICE FOR PARTS MANAGEMENT |
| MIL-STD-3018 Base Document:2007 | Parts Management (S/S by MIL-STD-11991) |
| IEC 62396-1:2016 | Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
| GEIA STD 0002-1 : 2005 | AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) REQUIREMENTS, VOLUME 1 - INTEGRATED CIRCUITS AND SEMICONDUCTORS |
| IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
| EIA 4899 : 2001 | STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
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