PD IEC/TR 61967-4-1:2005

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Splitting ICs into IC function modules
   4.1 Background
   4.2 Benefits
   4.3 IC function modules
   4.4 Example matrix for splitting ICs into IC function
        modules
5 Workflow to perform IC EMC emission tests
   5.1 Emission test philosophy
   5.2 Flowchart of performing emission tests
6 Test configurations for IC function modules
   6.1 EMC test recommendations for IC function modules
   6.2 Port selection guide
   6.3 Test networks at selected ports
   6.4 Supply selection guide
   6.5 Test networks at selected supplies
   6.6 Parameter initialization of IC function modules
        for testing
   6.7 Test parameter for performing conducted emission
        measurements
7 Test board layout recommendations
   7.1 Common test board recommendations
   7.2 150 ohm network on 2 layer and multi layer PCB
   7.3 1 ohm network on 2 layer and multi-layer PCB
8 Test report
Annex A (normative) IEC 61967-4 test network modification
Annex B (informative) Trace impedance calculation
Annex C (informative) Examples for splitting ICs into IC
                      function modules

Acts as an application guidance and relates to IEC 61967-4. Provides advice for performing test methods by classifying types of integrated circuits (ICs) and providing hints for test applications related to the IC type classification.

Serves as an application guidance and relates to IEC 61967-4. The division of IC types into -> IC function modules and the software modules for -> cores with CPU can be used for Parts 3, 5 and 6 of IEC 61967. Gives advice for performing test methods described in IEC 61967-4 by classifying types of integrated circuits (ICs) and providing hints for test applications related to the IC type classification. To obtain comparable results of IC emission measurements using IEC 61967-4, definitions are given which are in addition to the general conditions specified in IEC 61967-1 and IEC 61967-4. These definitions concern IC related operating modes, pins and ports to be tested, test set-ups according IEC 61967-4, including description of load circuits and RF path, and IC related emission limits (or limit classes). Parts of the guidance provided by this technical report may be applicable to other parts of IEC 61967.