PD IEC/PAS 63015:2016
Current
The latest, up-to-date edition.
Definition of “Low-Halogen” for electronic products
Hardcopy , PDF
English
08-31-2016
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Requirements for low-halogen electronic products
5 Compliance process for low-halogen electronic
materials and components
6 Marking and labeling for 'low-halogen'
electronic products
Annex A (informative) - Where BFRs, CFRs, and
PVC are used in electronic or electrical
products
Annex B (informative) - Suggested test protocols
- Low-halogen process flow
Annex C (informative) - Clarification for including
only bromine and chlorine in the definition
of low-halogen materials
Annex D (informative) - Differences between
JS709B and JS709A
Bibliography
Gives terms and definitions for 'low-halogen' electronic products that have the potential to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling.
Committee |
GEL/111
|
DocumentType |
Standard
|
Pages |
20
|
PublisherName |
British Standards Institution
|
Status |
Current
|
This document provides terms and definitions for “low-halogen” electronic products that have the potential to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling. This standard may be applied to all nonmetallic and nonceramic materials within electronic products including, but not limited to, materials in the following components commonly found in electronic products:
transistors, integrated circuits, modules consisting mainly of integrated circuits (e.g. multichip, hybrid), and memory modules;
resistors, capacitors, relays, inductors, and connectors;
printed circuit board assemblies (PCBAs) including components;
plastic in cables, sockets, switches and external wiring;
mechanical plastics (enclosures, fans, etc.);
films, tapes, inks, and adhesives;
soldering flux residues (when present);
sound, shock, and vibration dampeners (foams, resins, etc.).
This document establishes the maximum concentration level for the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC. While the halogen group contains fluorine, chlorine, bromine, iodine, and astatine, this document will use the term “low-halogen” to refer only to bromine and chlorine. Refer to Annex C for further explanation for exclusion of astatine, iodine and fluorine.
NOTE The definition of “low-halogen” is different from the term “halogen-free” as described in IEC 61249-2 sectional standard related to non-halogenated base material and as defined in the J-STD-609A marking and labeling standard; standards that pertain only to printed boards and are currently in use in the electronics and solid-state industries.
BFRs, CFRs, and PVC in materials that may be used during processing, in product delivery systems, or in packaging, but do not remain within the final product are not included in the scope of this document.
Standards | Relationship |
IEC PAS 63015:2016 | Identical |
IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
ISO 11469:2016 | Plastics — Generic identification and marking of plastics products |
IEC 61249-2-26:2005 | Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
IPC WP/TR 584 : A | IPC WHITE PAPER AND TECHNICAL REPORT ON THE USE OF HALOGENATED FLAME RETARDANTS IN PRINTED CIRCUIT BOARDS AND ASSEMBLIES |
EN 14582:2016 | Characterization of waste - Halogen and sulfur content - Oxygen combustion in closed systems and determination methods |
IPC TM 650 : 0 | TEST METHODS MANUAL |
IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IEC 61249-2-21:2003 | Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
IEC 62321:2008 | Electrotechnical products - Determination of levels of six regulated substances (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers) |
IEC 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
ISO 1043-4:1998 | Plastics Symbols and abbreviated terms Part 4: Flame retardants |
IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
IEC 61249-2-23:2005 | Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad |
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