NF EN 61189-5 : 2008
Current
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
Published date
01-12-2013
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AVANT-PROPOS
INTRODUCTION
1 Domaine d'application
2 Références normatives
3 Exactitude, fidélité et résolution
4 Catalogue des méthodes d'essai approuvées
5 P: Méthodes d'essai de préparation/conditionnement
6 V: Méthodes d'essai visuel
7 D: Méthodes d'essai dimensionnel
8 C: Méthodes d'essai chimique
9 M: Méthodes d'essai mécanique
10 E: Méthodes d'essai électrique
11 N: Méthodes d'essai environnemental
12 Méthodes d'essai diverses X
Bibliographie
Annexe ZA (normative) Références normatives à d'autres
publications internationales avec les publications
européennes correspondantes
La présente partie de la CEI 61189 est un catalogue de méthodes d'essai représentant les méthodologies et modes opératoires applicables aux assemblages de carte à circuit imprimé soumis à essai.
| DevelopmentNote |
Indice de classement: C93-735. PR NF EN 61189-5 April 2004. (04/2004)
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| DocumentType |
Standard
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| PublisherName |
Association Francaise de Normalisation
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| Status |
Current
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| Standards | Relationship |
| EN 61189-5 : 2006 | Identical |
| IEC 61189-5:2006 | Identical |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
| NF ISO 5725-2 : 1994 | APPLICATION OF STATISTICS - ACCURACY (TRUENESS AND PRECISION) OF MEASUREMENT METHODS AND RESULTS - PART 2: BASIC METHOD FOR THE DETERMINATION OF REPEATABILITY AND REPRODUCIBILITY OF A STANDARD MEASUREMENT METHOD |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| NF EN 61189-6 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
| NF EN 61190-1-2 : 2014 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| NF EN 61249-2-7 : 2002 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| NF EN 61190-1-1 : 2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| NF EN 61189-3 : 2013 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| NF EN ISO 9455-2 : 1995 | SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| NF EN 60068-1 : 2014 | ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
| NFC 20 720 : 87 AMD 1 1988 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
| ISO 5725-2:1994 | Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method |
| ISO 9001:2015 | Quality management systems — Requirements |
| NF EN 2199455-1 : 1994 | SOFT SOLDERING FLUXES - TEST METHODS - PART 1: DETERMINATION OF NON-VOLATILE MATTER, GRAVIMETRIC METHOD |
| NF EN 62137 : 2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| NF EN ISO 9001 : 2015 | QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| NF EN 61189-1 : 98 AMD 1 2002 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
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