NF EN 60384-1 : 2016
Current
Current
The latest, up-to-date edition.
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
Published date
01-12-2013
Publisher
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La présente partie de la CEI 60384 est une spécification générique, qui s'applique aux condensateurs fixes utilisés dans les équipements électroniques. Elle établit des définitions, des procédures de controle et des méthodes d'essai normalisées à utiliser dans les spécifications intermédiaires et particulières des composants électroniques, pour les systèmes d'assurance de la qualité ou pour tout autre usage.
| DevelopmentNote |
Indice de classement: C93-112-1. PR NF EN 60384-1 April 2005. (04/2005) PR NF EN 60384-1 January 2007. (01/2007) PR NF EN 60384-1 November 2014. (12/2014) 2014 version is still active. (01/2017)
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| DocumentType |
Standard
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| PublisherName |
Association Francaise de Normalisation
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| Status |
Current
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| Standards | Relationship |
| BS EN 60384-1:2016 | Identical |
| I.S. EN 60384-1:2016 | Identical |
| DIN EN 60384-1 : 2017 | Identical |
| EN 60384-1:2016 | Identical |
| NBN EN 60384-1 : 2016 | Identical |
| SN EN 60384-1 : 2016 | Identical |
| IEC 60384-1:2016 | Identical |
| NF EN 60384-18-2 : 2008 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18-2: BLANK DETAIL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH NON-SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| NF EN 60384-16 : 2006 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 16: SECTIONAL SPECIFICATION: FIXED METALLIZED POLYPROPYLENE FILM DIELECTRIC D.C. CAPACITORS |
| NF EN 60384-18-1 : 2008 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE - ASSESSMENT LEVEL EZ |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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