NF EN 60194 : 2006
Current
The latest, up-to-date edition.
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
01-12-2013
Foreword
1 Scope
2 Normative references
3 General
4 Terms and definitions
Annex A (informative) Principles and use of the classification
code
Annex B (informative) Acronyms
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Specifies the terminology used in the field of printed circuit boards and printed circuit board assembly products.
| DevelopmentNote |
Indice de classement: C93-730 PR NF EN 60194 February 2006 (02/2006)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60194:2007-03 | Identical |
| I.S. EN 60194:2006 | Identical |
| BS EN 60194:2006 | Identical |
| EN 60194:2006 | Identical |
| NF EN 62137-1-5 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
| NF EN 62137-1-4 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
| NF EN 62137-1-3 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
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