NF EN 60068-2-83 : 2012
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The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
Published date
01-12-2013
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| DevelopmentNote |
Indice de classement: C20-783. PR NF EN 60068-2-83 April 2010. (04/2010)
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| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
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| Status |
Current
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| Standards | Relationship |
| IEC 60068-2-83:2011 | Identical |
| EN 60068-2-83 : 2011 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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