NEN EN IEC 60191-6-2 : 2002
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
Published date
01-12-2013
Publisher
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Includes the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages and as well as for column terminal packages.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-2:2002 | Identical |
| IEC 60191-6-2:2001 | Identical |
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