NBN EN 62137 : 2005
Current
The latest, up-to-date edition.
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
01-12-2013
1 Scope
2 Normative references
3 Terms and definitions
4 Abbreviations
5 Solder joint quality test methods
5.1 Reflow solderability test for solder joint
5.2 Reserved for future use
6 Mechanical test methods
6.1 Bending test for solder joint
6.2 Drop test for solder joint
7 Environment test methods
7.1 Temperature cycling test for solder joint
7.2 Reserved for future use
Annex A (informative) Informative test methods for test
board - Guidance
Annex B (informative) Standard mounting process for area
array type packages and peripheral
terminal type packages (QFN and SON)
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography
Figures
Tables
Defines the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.
| DocumentType |
Standard
|
| PublisherName |
Belgian Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 62137:2005-04 | Identical |
| EN 62137:2004/corrigendum:2005 | Identical |
| I.S. EN 62137:2005 | Identical |
| BS EN 62137:2004 | Identical |
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