• Shopping Cart
    There are no items in your cart

NASA MSFC STD 2907 : 2006

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS

Available format(s)

Hardcopy , PDF

Withdrawn date

06-22-2009

Language(s)

English

Published date

01-01-2006

US$55.00
Excluding Tax where applicable

DOCUMENT HISTORY LOG
FOREWORD
1.0 SCOPE
2.0 APPLICABLE DOCUMENTS
3.0 DEFINITIONS
4.0 GENERAL REQUIREMENTS
    4.1 Classification
    4.2 Qualification
    4.3 Deviation and Waiver Requests
    4.4 Quality Management System
    4.5 Materials
         4.5.1 Metal-Clad Laminates
         4.5.2 Bonding Layer (Prepreg)
         4.5.3 Plating or Solder Coating
         4.5.4 Electroless Copper Plating
         4.5.5 Electrolytic Copper Plating
         4.5.6 Tin-Lead Plating
         4.5.7 Solder Coating
         4.5.8 Gold Plating
         4.5.9 Nickel Plating
         4.5.10 Solder Mask
         4.5.11 Marking Ink
         4.5.12 Solvents
    4.6 Quality Conformance Test Circuitry
         4.6.1 Type 1 and Type 2
         4.6.2 Type 3
5.0 DETAILED REQUIREMENTS
    5.1 Dimensions
         5.1.1 Hole Patterns
         5.1.2 Overall
    5.2 Conductor Width and Spacing
    5.3 Measling and Crazing
    5.4 Delamination
    5.5 Undercutting
    5.6 Conductor Outgrowth
    5.7 Bow and Twist
    5.8 Plating Adhesion
    5.9 Dielectric Withstanding Voltage
    5.10 Cleanliness
    5.11 Marking
    5.12 Solder Mask
    5.13 Specific Requirements
         5.13.1 Plating or Coating Thickness
         5.13.2 Annular Ring
    5.14 Specific Requirements
         5.14.1 Plated-Through Hole
         5.14.2 Hole Cleaning and Etchback (Type 3 Only)
         5.14.3 Plating and Coating Thickness
         5.14.4 Annular Ring
         5.14.5 Dielectric Layer Thickness
         5.14.6 Layer-to-Layer Registration
         5.14.7 Thermal Stress
         5.14.8 Hole Solderability
         5.14.9 Rework Solderability
         5.14.10 Circuitry (Type 3 Only)
         5.14.11 Thermal Shock
    5.15 Quality Assurance Provisions
         5.15.1 Responsibility for Inspection
         5.15.2 Test Equipment and Inspection Facilities
         5.15.3 Classifications of Inspection
         5.15.4 Materials Inspection
         5.15.5 Supplier Qualification Inspection
         5.15.6 Quality Conformance Inspection
         5.15.7 Inspection Lot
         5.15.8 Sampling Plan
6.0 NOTES

Sets forth requirements for rigid printed wiring boards (PWB's).

DocumentType
Standard
Pages
27
PublisherName
National Aeronautics and Space Administration
Status
Withdrawn

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
SAE AMS QQ N 290 : 2015 NICKEL PLATING (ELECTRODEPOSITED)
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
A-A-56032 Revision D:2003 INK, MARKING, EPOXY BASE
ANSI/ISO/ASQ Q9001:2008 Quality Management Systems - Requirements
SAE AMS P 81728 : 2015 PLATING, TIN-LEAD (ELECTRODEPOSITED)
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.