MIL STD 750-2 : A
Current
The latest, up-to-date edition.
MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
English
Important note : All end users must be registered with an Account prior to user licenses being assigned.
FOREWORD
SUMMARY OF REVISION A, CHANGE 2 MODIFICATIONS
1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES
CONCLUDING MATERIAL
Determines uniform test methods for the mechanical testing to determine resistance to deleterious effects of natural elements and conditions surrounding military operations.
| Committee |
FSC 5961
|
| DocumentType |
Standard
|
| Pages |
301
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| MIL-STD-750-1 Revision A:2015 | Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999 |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| ISO 14644-2:2015 | Cleanrooms and associated controlled environments Part 2: Monitoring to provide evidence of cleanroom performance related to air cleanliness by particle concentration |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL-STD-750-1 Revision A:2015 | Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999 |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| MIL-STD-750-3 Base Document:2012 | Transistor Electrical Test Methods for Semiconductor Devices Part 3: Test Methods 3000 Through 3999 |
| FED-STD-595 Revision C:2008 | COLORS USED IN GOVERNMENT PROCUREMENT |
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.