MIL-STD-2118 Base Document:1984
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Flexible and Rigid Flex Printed Wiring for Electronic Equipment Design Requirements for (S/S by IPC2221 and IPC2223)
05-04-1984
08-27-1999
Criteria governing flexible and rigid to flexible and design considerations for mounting parts and assemblies upon them.
| DocumentType |
Standard
|
| Pages |
51
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
This standard establishes design requirements governing flexible printed-wiring with or without shields or stiffeners and rigid to flexible printed-wiring (hereinafter referred to as rigid-flex) with or without plated-through holes and design considerations for the mounting of parts and assemblies thereon. In the rigid-flex applications, the conductor layers that are in the flexible portion are also a layer in the rigid multilayer board. All board types shall have the conductor patterns (excluding the lands) protected by an insulating layer, except for the external conductors on the rigid section of type 4 boards. When components are mounted on flexible and rigid-flex printed-wiring, the mounting area shall be conformally coated. Conformal coating shall be in accordance with Mil-I-46058.
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| MIL-C-28809 Revision B:1988 | Circuit Card Assemblies, Rigid, Flexible, And Rigid Flex (No S/S Document) |
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES (NO S/S DOCUMENT) |
| DOD-STD-2000-2 Revision A:1986 | PART & COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL & ELECTRONIC ASSEMBLIES (S/S BY MIL-STD-2000) |
| MIL-STD-100 Revision G:1997 | ENGINEERING DRAWINGS (S/S BY ASME-Y14.100, ASME-Y14.24, ASME-Y14.35M, AND ASME-14.34M) |
| ASTM F 683 : 2014 : REDLINE | Standard Practice for Selection and Application of Thermal Insulation for Piping and Machinery |
| MIL-STD-1861 Revision A:1993 | ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE, SELECTION AND USE OF (S/S BY MIL-HDBK-1861) |
| MIL-STD-1547 Revision B:1992 | Electronic Parts, Materials, and Processes for Space and Launch Vehicles |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-STD-130 Revision N:2007 | Identification Marking of U.S. Military Property |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| QQ-C-576 Revision B:1961 | Copper Flat Products with Slit and Edge-Rolled, Sheared, Sawed or Machined Edges, (Plate, Bar, Sheet, and Strip) (S/S by ASTM-B152) |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| MIL-C-14550 Revision B:1983 | Copper Plating (Electrodeposited) (S/S by SAE-AMS2418) |
| MIL-P-81728 Revision A:1973 | PLATING, TIN LEAD (ELECTRODEPOSITED (S/S BY SAE-AMS-P-81728) |
| IPC D 350 : 0 | PRINTED BOARD DESCRIPTION IN DIGITAL FORM |
| IPC FC 241 : C1992 AMD 1 1995 | FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING |
| QQ-W-343 Revision G:1997 | WIRE, ELECTRICAL, COPPER (UNINSULATED) (S/S BY A-A-59551) |
| MIL P 28809 : A | PRINTED WIRING ASSEMBLIES |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290) |
| IPC FC 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
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