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MIL-STD-202-208 Base Document:2015

NA

NA

Status of Standard is Unknown

Method 208, Solderability

Available format(s)

PDF

Language(s)

English

Published date

04-18-2015

US$20.00
Excluding Tax where applicable

FOREWORD
1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES

Establishes the solderability of all terminations which are normally joined by a soldering operation.

DocumentType
Standard
Pages
6
PublisherName
US Military Specs/Standards/Handbooks
Status
NA

The purpose of this test method is to determine the solderability of all terminations which are normally joined by a soldering operation. This determination is made on the basis of the ability of these terminations to be wetted by solder and the predictability of a suitable fillet resulting from solder application. These procedures will verify that the pre-assembly lead finish provides a solderable surface of sufficient quality to enable satisfactory soldering.

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DSCC 97010E:2023 RESISTOR, FIXED, FILM, PRECISION 0.3 WATT, POWER CURVE B

IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES

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