MIL-STD-1580 Revision B:2003
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
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Superseded date
06-26-2020
Superseded by
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES
Defines the general requirements for performance of destructive physical analysis (DPA) on samples of parts. In addition to the requirements for the analysis procedures, the general criteria for interpreting results, such as for the acceptance or rejection of associated production lots, is included for typical electronic, electromagnetic, and electromechanical parts.
| Committee |
FSC 59GP
|
| DocumentType |
Standard
|
| Pages |
122
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
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| SAE AS 6294/2 : 2018 | REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS |
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| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| MIL-STD-981 Revision C:2010 | DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS |
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| 17/30318744 DC : 0 | BS ISO 20188 - SPACE SYSTEMS - PRODUCT ASSURANCE REQUIREMENTS FOR COMMERCIAL SATELLITES |
| SAE ARP 6328 : 2016 | GUIDELINE FOR DEVELOPMENT OF COUNTERFEIT ELECTRONIC PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION SYSTEMS |
| ISO 20188:2018 | Space systems — Product assurance requirements for commercial satellites |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| SAE AS 6171 : 2016 | TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS |
| PD IEC/TS 62647-2:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| SAE AS 6294/1 : 2017 | REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS |
| DSCC 13003 : A | RESISTOR NETWORK, 8 PIN, DUAL-IN-LINE PACKAGE (DIP), MULTI RESISTANCE VALUES |
| MIL PRF 55365 : 0012 | CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR |
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| MIL-PRF-39006-22 Revision J:2012 | Capacitor, Fixed, Electrolytic (Nonsolid Electrolyte), Tantalum (Polarized, Sintered Slug), +85 Degrees C (Voltage Derated to +125 Degrees C), Established Reliability, Style CLR79 |
| MIL-PRF-83401 Revision H:2006 | RESISTOR NETWORKS, FIXED, FILM AND CAPACITOR-RESISTOR NETWORKS, CERAMIC CAPACITOR AND FIXED, FILM, RESISTORS, GENERAL SPECIFICATION FOR |
| MIL-PRF-55342 Revision H:2003 | RESISTOR, CHIP, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-PRF-39012 Revision F:2014 | CONNECTORS, COAXIAL, RADIO FREQUENCY, GENERAL SPECIFICATION FOR |
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| MIL-PRF-39005 Revision G:2013 | Resistor, Fixed, Wirewound (Accurate), Nonestablished Reliability, Established Reliability, General Specification for |
| MIL-PRF-55681 Revision G:2016 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL C 55302 : E | CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, RECEPTACLE |
| MIL-PRF-15733 Revision J:2010 | FILTERS AND CAPACITORS, RADIO FREQUENCY INTERFERENCE, GENERAL SPECIFICATION FOR |
| MIL-PRF-123 Revision D:2005 | CAPACITORS, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE STABLE AND GENERAL PURPOSE), HIGH RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-3098 Revision L:2017 | CRYSTAL UNITS, QUARTZ, GENERAL SPECIFICATION FOR |
| MIL-PRF-28861 Revision E:2016 | FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| DSCC 05017 : B | CAPACITORS, FIXED ELECTROLYTIC (NONSOLID ELECTROLYTE), TANTALUM ANODE AND CATHODE |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL-PRF-38534 Revision J:2015 | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| MIL-PRF-39006 Revision G:2006 | CAPACITOR, FIXED, ELECTROLYTIC (NONSOLID ELECTROLYTE), TANTALUM, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-39007 Revision J:2005 | Resistor, Fixed, Wirewound, (Power Type) Nonestablished Reliability, Established Reliability, and Space Level General Specification for |
| MIL-DTL-81381 Revision C:2005 | WIRE, ELECTRIC, POLYIMIDE-INSULATED, COPPER OR COPPER ALLOY |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| MIL-PRF-39014 Revision J:2016 | Capacitor, Fixed, Ceramic Dielectric (General Purpose), Established Reliability and Non-Established Reliability, General Specification for |
| MIL-PRF-39009 Revision E:2004 | RESISTOR, FIXED, WIREWOUND, (POWER TYPE, CHASSIS MOUNTED), NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-27 Revision G:2014 | TRANSFORMERS AND INDUCTORS (AUDIO, POWER, AND HIGH-POWER PULSE), GENERAL SPECIFICATION FOR |
| MIL-PRF-20 Revision N:2017 | CAPACITOR, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE COMPENSATING), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-DTL-38999 Revision M:2015 | Connectors, Electrical, Circular, Miniature, High Density, Quick Disconnect (Bayonet, Threaded or Breech Coupling), Environment Resistant with Crimp Removable Contacts or Hermetically Sealed with Fixed, Solderable Contacts, General Specification for |
| MIL-PRF-14409 Revision J:2014 | CAPACITORS, VARIABLE (PISTON TYPE, TUBULAR TRIMMER), GENERAL SPECIFICATION FOR |
| MIL-PRF-39001 Revision E:2009 | Capacitor, Fixed, MICA Dielectric, Established Reliability and Nonestablished Reliability, General Specification for |
| MIL-PRF-24236 Revision D:2006 | SWITCHES, THERMOSTATIC, (METALLIC AND BIMETALLIC), GENERAL SPECIFICATION FOR |
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| SAE AMS 2644 : 2013 | INSPECTION MATERIAL, PENETRANT |
| MIL-PRF-39035 Revision E:2008 | Resistor, Variable, Nonwirewound (Adjustment Type), Nonestablished Reliability, and Established Reliability, General Specification for |
| MIL-PRF-39003 Revision N:2016 | Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for |
| MIL-PRF-23648 Revision F:2005 | Resistor, Thermal (Thermistor) Insulated, General Specification for |
| SAE AS 81044 : 2011 | WIRE, ELECTRICAL, CROSSLINKED POLYALKENE, CROSSLINKED ALKANE-IMIDE POLYMER, OR POLYARLYENE INSULATED, COPPER OR COPPER ALLOY |
| MIL-PRF-15305 Revision F:2013 | COILS, ELECTRICAL, FIXED AND VARIABLE, RADIO FREQUENCY, GENERAL SPECIFICATION FOR |
| MIL-PRF-39016 Revision H:2017 | Relays, Electromagnetic, Established Reliability, General Specification for |
| MIL-PRF-83446 Revision D:2015 | COILS, RADIO-FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR |
| MIL-PRF-6106 Revision P:2014 | Relays, Electromagnetic General Specification for |
| MIL-PRF-19978 Revision L:2016 | Capacitor, Fixed, Plastic (or Paper-Plastic) Dielectric (Hermetically Sealed in Metal, Ceramic or Glass Cases), Established and Non-Established Reliability, General Specification for |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-PRF-39010 Revision E:1997 | Coil, Radio Frequency, Fixed, Molded, Established Reliability and Nonestablished Reliability, General Specification for |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-PRF-21038 Revision F:2004 | TRANSFORMERS, PULSE, LOW POWER GENERAL SPECIFICATION FOR |
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| MIL-PRF-83421 Revision F:2017 | CAPACITOR, FIXED, METALLIZED PLASTIC FILM DIELECTRIC, (DC, AC, OR DC AND AC), HERMETICALLY SEALED IN METAL CASES OR CERAMIC CASES, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
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| MIL-PRF-15160 Revision K:2013 | Fuses, Instrument, Power, and Telephone General Specification for |
| MIL-PRF-39015 Revision E:2006 | RESISTOR, VARIABLE, WIREWOUND, (LEAD SCREW ACTUATED), NONESTABLISHED RELIABILITY, AND ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-55182 Revision J:2017 | RESISTOR, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, AND SPACE LEVEL, GENERAL SPECIFICATION FOR |
| MIL-PRF-39017 Revision G:2006 | RESISTOR, FIXED, FILM (INSULATED), NONESTABLISHED RELIABILITY, AND ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-49470 Revision D:2017 | CAPACITOR, FIXED, CERAMIC DIELECTRIC, SWITCH MODE POWER SUPPLY (GENERAL PURPOSE AND TEMPERATURE STABLE), STANDARD RELIABILITY AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR |
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