MIL-STD-1546 Revision B:1992
Current
Current
The latest, up-to-date edition.
PARTS, MATERIALS, AND PROCESSES CONTROL PROGRAM FOR SPACE AND LAUNCH VEHICLES
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Important note : All end users must be registered with an Account prior to user licenses being assigned.Describes a Parts, Materials, and Processes Standardization Control and Management Program (PMPSCMP) used in the development, design, fabrication, and test of spacecraft and launch vehicles.
| Committee |
FSC 1820
|
| DevelopmentNote |
B NOTICE 1 - Notice of Cancellation without Replacement. B NOTICE 2 - Notice of Reinstatement. (11/2008)
|
| DocumentType |
Standard
|
| Pages |
58
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
| I.S. EN 14607-7:2004 | SPACE ENGINEERING - MECHANICAL - PART 7: MECHANICAL PARTS |
| MIL-HDBK-817 Base Document:1994 | SYSTEM DEVELOPMENT RADIATION HARDNESS ASSURANCE |
| MIL-STD-1543 Revision B:1988 | RELIABILITY PROGRAM REQUIREMENTS FOR SPACE AND LAUNCH VEHICLES |
| MIL-HDBK-814 Base Document:1994 | IONIZING DOSE AND NEUTRON HARDNESS ASSURANCE GUIDELINES FOR MICROCIRCUITS AND SEMICONDUCTOR DEVICES |
| BS EN 14607-7:2004 | Space engineering. Mechanical Mechanical parts |
| EN 14607-7:2004 | Space engineering - Mechnical - Part 7: Mechnical parts |
| MIL-STD-1576 Base Document:1984 | ELECTROEXPLOSIVE SUBSYSTEM SAFETY REQUIREMENTS AND TEST METHODS FOR SPACE SYSTEMS |
| 03/301399 DC : DRAFT JAN 2003 | EN 14607-7 - SPACE ENGINEERING - MECHANICAL - PART 7: MECHANICAL PARTS |
| MIL-STD-1535 Revision B:1992 | SUPPLIER QUALITY ASSURANCE PROGRAM REQUIREMENTS |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| MIL B 81705 : C | BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE |
| MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
| MIL-M-38510 Revision J:1991 | MICROCIRCUITS, SPECIFICATION FOR |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| MIL B 121 : F | BARRIER MATERIAL, GREASEPROOFED, WATERPROOFED, FLEXIBLE |
| MIL-STD-1543 Revision B:1988 | RELIABILITY PROGRAM REQUIREMENTS FOR SPACE AND LAUNCH VEHICLES |
| MIL-STD-965 Revision B:1993 | PARTS CONTROL PROGRAM |
| MIL B 22191 : D | BARRIER MATERIAL, TRANSPARENT, FLEXIBLE, HEAT SEALABLE |
| MIL B 131 : H | BARRIER MATERIAL, WATER VAPOR PROOF, GREASEPROOF, FLEXIBLE HEAT SEALABLE |
| MIL-STD-794 Revision E:1982 | PART AND EQUIPMENT, PROCEDURES FOR PACKAGING AND PACKING OF |
| MIL S 19500 : J | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL-Q-9858 Revision A:1963 | QUALITY PROGRAM REQUIREMENTS |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
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