MIL-PRF-31032 Revision C:2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Printed Circuit Board/Printed Wiring Board, General Specification for
05-07-2021
English
11-16-2016
Important note : All end users must be registered with an Account prior to user licenses being assigned.
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - THE QUALITY MANAGEMENT (QM) PROGRAM
APPENDIX B - QUALIFICATION
APPENDIX C - CONFORMANCE INSPECTION
APPENDIX D - TEST OPTIMIZATION
APPENDIX E - STATISTICAL SAMPLING, TEST, AND INSPECTION
PROCEDURES
APPENDIX F - TEST METHOD: RESISTANCE TO SOLDERING HEAT
APPENDIX G - TEST METHOD: SEQUENTIAL ELECTROCHEMICAL
REDUCTION ANALYSIS (SERA) SOLDERABILITY
APPENDIX H - TEST METHOD: SOLDER FLOAT SOLDERABILITY
APPENDIX J - SOLDERABILITY TESTING
Determines the general performance requirements for printed circuit boards or printed wiring boards and the verification requirements for insuring that these items meet the applicable performance requirements.
| DocumentType |
Standard
|
| Pages |
94
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
This specification establishes the general performance requirements for printed circuit boards or printed wiring boards (hereafter designated printed board) and the verification requirements for insuring that these items meet the applicable performance requirements. Certification and qualification to this specification allows manufacturer’s to apply the Qualified Manufacturers List (QML) (see 6.4.32) program to printed boards procured to non−QML documents such as MIL−PRF−55110 and MIL−PRF−50884 (see 6.3.5 and 6.5). The intent of this specification is to allow the printed board manufacturer the flexibility to implement best commercial practices to the maximum extent possible while still providing product that meets military performance needs (see 6.3.4). The principle concepts which allow this flexibility are as follows:
The manufacturer forms an internal quality review system or organization referred to in this document as the Technical Review Board (TRB) (see 6.4.51). The TRB is responsible for the implementation of a quality management (QM) plan (see 6.4.41). The implemented QM plan becomes the manufacturer’s quality management (QM) program (see 6.4.42).
b. A relationship is established between the manufacturer (see 6.4.18) and the qualifying activity (see 6.4.37).
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| MIL-PRF-31032-2 Revision C:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
| MIL-PRF-31032-1 Revision D:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
| MIL-STD-1353 Revision C:2014 | ELECTRICAL CONNECTORS, PLUG-IN SOCKETS AND ASSOCIATED HARDWARE, SELECTION AND USE OF |
| MIL-PRF-31032-4 Revision C:2017 | PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
| MIL-PRF-31032-6 Revision B:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| MIL-DTL-917 Revision F:2014 | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
| MIL-PRF-31032-3 Revision C:2017 | PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
| MIL-PRF-31032-5 Revision B:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| IEEE DRAFT 1505 : 0 | RECEIVER FIXTURE INTERFACE SPONSORED BY THE CONNECTORS TECHNICAL COMMITTEE TC-55 OF THE IEEE INSTRUMENTATION & MEASUREMENT SOCIETY |
| BS IEC 63004:2015 | Standard for receiver fixture interface |
| MIL-STD-13231 Base Document:1999 | MARKING OF ELECTRONIC ITEMS |
| NASA MSFC STD 2907 : 2006 | WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
| NASA JSC 27301 : 2009 | MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
| MIL-DTL-55302 Revision G:2009 | CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES |
| MIL-DTL-83739 Revision D:2012 | SWITCHES, ANTENNA, RADIO FREQUENCY, SOLID-STATE, GENERAL SPECIFICATION FOR |
| MIL-DTL-21097-14 Revision F:2005 | CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD MALE ADAPTER, CONTACT SPACING: 0.200, ALTERNATE DUAL ROW, TYPE CS, BLADE CONTACT (MOUNTING PROVISION A) |
| MIL-DTL-21097-3 Revision F:2005 | CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD COMPOSITE, ADAPTER, CONTACT SPACING (.200) INDIVIDUAL CONTACTS, TYPE CS |
| IEC 63004:2015 | Standard for receiver fixture interface |
| MIL-PRF-55310 Revision E:2006 | OSCILLATOR, CRYSTAL CONTROLLED, GENERAL SPECIFICATION FOR |
| MIL-DTL-28875 Revision C:2012 | Amplifiers, Radio-Frequency and Microwave, Solid-State, General Specification for |
| MIL-HDBK-1861 Revision B:2013 | Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ISO/IEC 17025:2005 | General requirements for the competence of testing and calibration laboratories |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| ISO 14253-1:2017 | Geometrical product specifications (GPS) — Inspection by measurement of workpieces and measuring equipment — Part 1: Decision rules for verifying conformity or nonconformity with specifications |
| ASME B89.7.3.2 : 2007 | GUIDELINES FOR THE EVALUATION OF DIMENSIONAL MEASUREMENT UNCERTAINTY |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| EIA 585 : 1991 | ZERO ACCEPTANCE NUMBER SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES OF ISOLATED LOTS |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
| IEC 61326-2-1:2012 | Electrical equipment for measurement, control and laboratory use - EMC requirements - Part 2-1: Particular requirements - Test configurations, operational conditions and performance criteria for sensitive test and measurement equipment for EMC unprotected applications |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| MIL A-A-59282 : 1998 | CHEMICALS, ANALYTICAL; GENERAL SPECIFICATION FOR |
| ANSI/NCSL Z540 2 : 1997(R2012) | U.S. GUIDE TO EXPRESSION OF UNCERTAINTY IN MEASUREMENT |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| ISO/IEC Guide 98-3:2008 | Uncertainty of measurement — Part 3: Guide to the expression of uncertainty in measurement (GUM:1995) |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.