MIL-PRF-28750 Revision J:2017
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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RELAYS, SOLID STATE, GENERAL SPECIFICATION FOR
Available format(s)
PDF
Superseded date
05-06-2019
Superseded by
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - CLASS 2 SOLID STATE RELAY QPL
SYSTEM REQUIREMENTS
APPENDIX B - REQUIREMENTS FOR HYBRID MICROCIRCUIT
ELEMENTS
Specifies the general requirements for hermetically sealed or encapsulated solid-state relays (SSR's), incorporating semiconductor, microelectronic, and passive circuit devices.
| Committee |
FSC 5945
|
| DevelopmentNote |
Supersedes MIL R 28750. (05/2001)
|
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| DSCC 85092 : G | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS |
| MIL-R-28750-6 Revision G:2014 | RELAY, SOLID STATE, HERMETICALLY SEALED, ISOLATED, 250 MA, 40 V DC, SIGNAL SWITCHING, SPST (N.O.) |
| DSCC 85145 : E | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, 240 MILLIAMPERES, +/-100 V DC BIDIRECTIONAL, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS |
| DSCC 88049 : C | RELAY, SOLID STATE, TRANSFORMER ISOLATED, 30 AMPERE LOAD AT 50 V DC, DC INPUT CONTROL, HERMETICALLY SEALED |
| MIL-DTL-917 Revision F:2014 | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
| MIL-DTL-16036 Revision M:2013 | SWITCHGEAR, POWER, LOW VOLTAGE, NAVAL SHIPBOARD |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| MIL-PRF-28750-9 Revision G:2015 | RELAY, SOLID-STATE, HERMETICALLY SEALED, CLASS 2, OPTICALLY ISOLATED, ZERO VOLTAGE TURN-ON, 1 AMPERE (2 AMPERES WITH HEAT SINK), 400 HZ, POWER SWITCHING, SPST (N.O.) |
| MIL-R-28750-7 Revision F:2014 | Relay, Solid State, Hermetically Sealed, Isolated, 100 MA, 250 V DC, Signal Switching, SPST (N. O.) (No S/S Document) |
| DSCC 86001 : F | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS, 1 AMPERE, 60 V DC MAXIMUM |
| MIL-PRF-28750-10 Revision D:2015 | RELAY, SOLID-STATE, SEALED, CLASS 1, OPTICALLY ISOLATED, ZERO VOLTAGE TURN-ON, 25 AMPERES, 250 V MAXIMUM, 400 HZ, POWER SWITCHING, SPST (N.O.) |
| MIL-R-28750-5 Revision G:2015 | RELAY, SOLID STATE, HERMETICALLY SEALED, ISOLATED, +/- 50 MA, +/- 40 V, AC OR DC, ANALOG SIGNAL SWITCHING, SPST (N. O.) |
| DSCC 87042 : E | RELAY, SOLID STATE, HERMETICALLY SEALED, ISOLATED, BI-DIRECTIONAL, 0.95 A, 60 V DC, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS |
| DSCC 87034 : D | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, 240 MILLIAMPERES, +/-85 V DC BIDIRECTIONAL, ANALOG SIGNAL SWITCHING SPST (N.O.), CMOS AND TTL CONTROL INPUTS, FAST SWITCHING |
| DSCC 88062 : G | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 2.1 AMPERES, 60 V DC, ANALOG SIGNAL SWITCHING, SPST (N.O.), TTL/CMOS CONTROL INPUTS, SHORT CIRCUIT PROTECTED, OUTPUT SWITCH STATUS |
| DSCC 86031 : K | RELAY, SOLID STATE, OPTICALLY ISOLATED, 10 AMPERE LOAD AT 250 V AC, DC INPUT CONTROL |
| DSCC 85006 : F | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 1.O AMPERE, 60 V DC, SPST (N.O.), CMOS INPUT |
| DSCC 89116 : E | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 0.25 TO 1.0 AMPERE, +/-80 V DC TO +/-350 V DC, ANALOG SIGNAL SWITCHING, SPST (NO), TTL CONTROL INPUTS |
| DSCC 90091 : G | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 1 OR 2 A, WITH OR WITHOUT CIRCUIT-BREAKER ACTION OR STATUS INDICATION, 6-PIN CERAMIC DUAL-IN-LINE PACKAGE |
| MIL-STD-202-211 Base Document:2015 | METHOD 211, TERMINAL STRENGTH |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-449 Revision D:1973 | MEASUREMENT OF RADIO FREQUENCY SPECTRUM CHARACTERISTICS |
| MIL-STD-202-304 Base Document:2015 | Method 304, Resistance-Temperature Characteristic |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| MIL-STD-202-305 Base Document:2015 | Method 305, Capacitance |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL-PRF-38534 Revision J:2015 | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| MIL-STD-202-101 Base Document:2015 | Method 101, Salt Atmosphere (Corrosion) |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
| MIL-STD-202-215 Base Document:2015 | METHOD 215, RESISTANCE TO SOLVENTS |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| MIL-STD-461 Revision G:2015 | REQUIREMENTS FOR THE CONTROL OF ELECTROMAGNETIC INTERFERENCE CHARACTERISTICS OF SUBSYSTEMS AND EQUIPMENT |
| MIL DTL 17 : J | CABLES, RADIO FREQUENCY, FLEXIBLE AND SEMIRIGID, GENERAL SPECIFICATION FOR |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| FED-STD-H28 Revision A:1994 | Screw-Thread Standards for Federal Services |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-112 Base Document:2015 | METHOD 112, SEAL |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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