MIL-HDBK-217 Revision F:1991

Section 1: Scope
1.1 Purpose
1.2 Application
1.3 Computerized reliability prediction
Section 2: Reference documents
Section 3: Introduction
3.1 Reliability engineering
3.2 The role of reliability prediction
3.3 Limitations of reliability predictions
3.4 Part stress analysis prediction
Section 4: Reliability analysis evaluation
Section 5: Microcircuits, introduction
5.1 Gate/logic arrays and microprocessors
5.2 Memories
5.3 VHSIC/VHSIC like
5.4 GaAs MMIC and digital devices
5.5 Hybrids
5.6 SAW devices
5.7 Magnetic bubble memories
5.8 Pi T table for all
5.9 C2 table for all
5.10 Pi E, pi L and pi Q tables for all
5.11 TJ determination, (all except hybrids)
5.12 TJ determination, (for hybrids)
5.13 Examples
Section 6: Discrete semiconductors
6.0 Discrete semiconductors, introduction
6.1 Diodes, low frequency
6.2 Diodes, high frequency (microwave, RF)
6.3 Transistors, low frequency, bipolar
6.4 Transistors, low frequency, Si FET
6.5 Transistors, unijunction
6.6 Transistors, low noise, high frequency, bipolar
6.7 Transistors, high power, high frequency, bipolar
6.8 Transistors, high frequency, GaAs FET
6.9 Transistors, high frequency, Si FET
6.10 Thyristors and SCRs
6.11 Optoelectronics, detectors, isolators, emitters
6.12 Optoelectronics, alphanumeric displays
6.13 Optoelectronics, laser diode
6.14 TJ determination
6.15 Example
Section 7: Tubes
7.1 All types except TWT and magnetron
7.2 Traveling wave
7.3 Magnetron
Section 8: Lasers
8.0 Introduction
8.1 Helium and argon
8.2 Carbon dioxide, sealed
8.3 Carbon dioxide, flowing
8.4 Solid state, ND:YAG and Ruby Rod
Section 9: Resistors
9.0 Introduction
9.1 Fixed, composition (RCR, RC)
9.2 Fixed, film (RLR, RL, RN, (R,C, or N), RN)
9.3 Fixed, film, power (RD)
9.4 Network, fixed, film (RZ)
9.5 Fixed, wirewound (RBR, RB)
9.6 Fixed, wirewound, power (RWR, RW)
9.7 Fixed, wirewound, power, chassis mounted (RER,
       RE)
9.8 Thermistor (RTH)
9.9 Variable, wirewound (RTR, RT)
9.10 Variable, wirewound, precision (RR)
9.11 Variable, wirewound, semiprecision (RA, RK)
9.12 Variable, wirewound, power (RP)
9.13 Variable, nonwirewound (RJ, RJR)
9.14 Variable, composition (RV)
9.15 Variable, nonwirewound, film and precision (RQ,
       RVC)
9.16 Calculation of stress ratio for potentiometers
9.17 Example
Section 10: Capacitors
10.1 Fixed, paper, by-pass (CP, CA)
10.2 Fixed, feed-through (CZR, CZ)
10.3 Fixed, paper and plastic film (CPV, CQR and CQ)
10.4 Fixed, metallized paper, paper-plastic and
       plastic (CH, CHR)
10.5 Fixed, plastic and metallized plastic
10.6 Fixed, super-metallized plastic (CRH)
10.7 Fixed, MICA (CM, CMR)
10.8 Fixed, MICA, button (CB)
10.9 Fixed, glass (CY, CYR)
10.10 Fixed, ceramic, general purpose (CK, CKR)
10.11 Fixed, ceramic, temperature compensating and chip
       (CCR and CC, CDR)
10.12 Fixed, electrolytic, tantalum, solid (CSR)
10.13 Fixed, electrolytic, tantalum, non-solid (CL,CLR)
10.14 Fixed, electrolytic, aluminium (CUR and CU)
10.15 Fixed, electrolytic (dry), aluminium (CE)
10.16 Variable, ceramic (CV)
10.17 Variable, piston type (PC)
10.18 Variable, air trimmer (CT)
10.19 Variable and fixed, gas or vacuum (CG)
10.20 Example
Section 11: Inductive devices
11.1 Transformers
11.2 Coils
11.3 Determination of hot spot temperature
Section 12: Rotating devices
12.1 Motors
12.2 Synchros and resolvers
12.3 Elapsed time meters
12.4 Example
Section 13: Relays
13.1 Mechanical
13.2 Solid state and time delay
Section 14: Switches
14.1 Toggle or pushbutton
14.2 Basic sensitive
14.3 Rotary
14.4 Thumbwheel
14.5 Circuit breakers
Section 15: Connectors
15.1 General (except printed circuit board)
15.2 Printed circuit board
15.3 Integrated circuit sockets
Section 16: Interconnection assemblies
16.1 Interconnection assemblies with plated through
       holes
Section 17: Connections
17.1 Connections
Section 18: Meters
18.1 Meters, panel
Section 19: Quartz crystals
19.1 Quartz crystals
Section 20: Lamps
20.1 Lamps
Section 21: Electronic filters
21.1 Electronic filters, non-tunable
Section 22: Fuses
22.1 Fuses
Section 23: Miscellaneous parts
23.1 Miscellaneous parts
Appendix A: Parts count reliability prediction
Appendix B: VHSIC/VHSIC-like and VLSI CMOS (detailed
             model
Appendix C: Bibliography
Tables
3-1 Parts with multi-level quality specifications
3-2 Environmental symbol and description
4-1 Reliability analysis checklist
6-1 Default case temperatures for all environments
       (deg C)
6-2 Approximate thermal resistance for semiconductor
       devices in various package sizes
Figures
5-1 Cross sectional view of a hybrid with a single
       multi-layered substrate
8-1 Examples of active optical surfaces
9-1 MIL-R-39008 derating curve

Establishes uniform methods for predicting the reliability of military electronic equipment and systems. It gives a common basis for reliability predictions during acquisition programmes and in the evaluation of related or competitive design. Part Stress Analysis and Parts Count are the 2 methods used. Coverage includes reliability analysis evaluation, discrete semiconductors and rotating devices.