MIL-DTL-28754-100 Revision A:2015
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 200 CONTACT, CENTER
Available format(s)
PDF
Superseded date
04-15-2021
Language(s)
English
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.| Committee |
FSC 5935
|
| DevelopmentNote |
Supersedes MIL C 28754/100. (01/2016)
|
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| MIL C 28754 : D | CONNECTOR, ELECTRICAL, MODULAR AND COMPONENT PARTS, GENERAL SPECIFICATION FOR |
| SAE AMS 4173 : 2013 | ALUMINUM ALLOY, EXTRUSIONS 1.0MG - 0.60SI - 0.30CU - 0.20CR (6061-T6511 OR T6510) SOLUTION HEAT TREATED, STRESS RELIEVED BY STRETCHING, STRAIGHTENED, AND PRECIPITATION HEAT TREATED |
| SAE AMS 4150 : 2013 | ALUMINUM ALLOY, EXTRUSIONS AND RINGS 1.0MG - 0.60SI - 0.28CU - 0.20CR - (6061-T6) SOLUTION AND PRECIPITATION HEAT TREATED |
| MIL-C-28859 Revision B:1990 | CONNECTOR COMPONENT PART, ELECTRICAL BACK PLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR |
| SAE AMS 2418 : 2017 | PLATING, COPPER |
| MIL-PRF-680 Revision C:2010 | DEGREASING SOLVENT |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| MIL-DTL-28754-94 Revision A:2015 | CONNECTORS, ELECTRICAL, MODULAR, CONNECTOR FRAME, TYPE 4, DIP, 0.4 PITCH, FORMAT C, D AND E |
| MIL A 8625 : F | ANODIC COATINGS FOR ALUMINUM AND ALUMINUM ALLOYS |
| A-A-56032 Revision D:2003 | INK, MARKING, EPOXY BASE |
| SAE AMS P 81728 : 2015 | PLATING, TIN-LEAD (ELECTRODEPOSITED) |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
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