JIS Z 3198-6:2003
Current
The latest, up-to-date edition.
Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead
Hardcopy , PDF
English, Japanese
06-20-2003
Important note : All end users must be registered with an Account prior to user licenses being assigned.
This Standard specifies methods for 45 deg. pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
| DocumentType |
Test Method
|
| Pages |
7
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS Z 3284:1994 | Solder paste |
| JIS Z 3283:2006 | Resin flux cored solders |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.