JIS C 62137-4:2016
Current
Current
The latest, up-to-date edition.
Electronics Assembly Technology - Part 4: Endurance Test Methods For Solder Joint Of Area Array Type Package Surface Mount Devices
Available format(s)
Hardcopy
Language(s)
Japanese
Published date
03-22-2016
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.| DocumentType |
Test Method
|
| Pages |
42
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62137-4:2014 | Identical |
2016 [22/03/2016]
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