ISO 9454-1:2016
Current
Current
The latest, up-to-date edition.
Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
French, English
Published date
02-02-2016
Important note : All end users must be registered with an Account prior to user licenses being assigned.
ISO 9454-1:2016 specifies a coding system for the classification of fluxes intended for use with soft solders, according to their active fluxing ingredients, together with requirements for labelling and packaging.
| DevelopmentNote |
Supersedes ISO/DIS 9454-1. (02/2016)
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| DocumentType |
Standard
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| Pages |
9
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| PublisherName |
International Organization for Standardization
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| Status |
Current
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| Supersedes |
| Standards | Relationship |
| NF EN ISO 9454-1 : 2016 | Identical |
| NBN EN ISO 9454-1 : 2016 | Identical |
| NEN EN ISO 9454-1 : 2016 | Identical |
| NS EN ISO 9454-1 : 2016 | Identical |
| I.S. EN ISO 9454-1:2016 | Identical |
| PN EN ISO 9454-1 : 2016 | Identical |
| SN EN ISO 9454-1 : 2016 | Identical |
| UNI EN ISO 9454-1 : 2016 | Identical |
| UNE-EN ISO 9454-1:2016 | Identical |
| BS EN ISO 9454-1:2016 | Identical |
| EN ISO 9454-1:2016 | Identical |
| DIN EN ISO 9454-1:2016-07 | Identical |
| DIN 8511-2:1988-05 | Corresponds |
| I.S. EN 29454-1:1994 | Identical |
| UNE-EN 29454-1:1996 | Identical |
| NEN ISO 9454-1 : 1994 | Identical |
| EN 29454-1:1993 | Identical |
| PN EN 29454-1 : 2000 | Identical |
| 12/30270787 DC : 0 | BS EN ISO 9455-5 - SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST |
| 16/30337152 DC : 0 | BS EN ISO 9455-11 - SOFT SOLDERING FLUXES - TEST METHODS - PART 11: SOLUBILITY OF FLUX RESIDUES |
| PREN ISO 9455-16 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| DIN EN 806-4:2010-06 | Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation |
| 16/30334455 DC : 0 | BS EN ISO 9455-13 - SOFT SOLDERING FLUXES - TEST METHODS - PART 13: DETERMINATION OF FLUX SPATTERING |
| UNE-EN ISO 9455-11:2018 | Soft soldering fluxes - Test methods - Part 11: Solubility of flux residues (ISO 9455-11:2017) |
| I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| I.S. EN ISO 9455-11:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 11: SOLUBILITY OF FLUX RESIDUES (ISO 9455-11:2017) |
| EN ISO 9455-11:2017 | Soft soldering fluxes - Test methods - Part 11: Solubility of flux residues (ISO 9455-11:2017) |
| EN ISO 9455-13:2017 | Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017) |
| I.S. EN ISO 9455-16:2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| I.S. EN ISO 9455-10:2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
| BS EN ISO 12224-1:1998 | Solder wire, solid and flux cored. Specification and test methods Classification and performance requirements |
| UNI EN ISO 9455-16 : 2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| 14/30309696 DC : 0 | BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| BS EN ISO 9455-12:1994 | Soft soldering fluxes. Test methods Steel tube corrosion test |
| BS EN ISO 9454-2:2001 | Soft soldering fluxes. Classification and requirements Performance requirements |
| BS EN ISO 9455-16:2013 | Soft soldering fluxes. Test methods Flux efficacy test, wetting balance method |
| BS EN ISO 9455-3:1995 | Soft soldering fluxes. Test methods Determination of acid value, potentiometric and visual titration methods |
| DIN EN 12502-2:2005-03 | PROTECTION OF METALLIC MATERIALS AGAINST CORROSION - GUIDANCE ON THE ASSESSMENT OF CORROSION LIKELIHOOD IN WATER DISTRIBUTION AND STORAGE SYSTEMS - PART 2: INFLUENCING FACTORS FOR COPPER AND COPPER ALLOYS |
| ONORM EN ISO 9455-5 : 2014 | SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
| EN 12502-2:2004 | Protection of metallic materials against corrosion - Guidance on the assessment of corrosion likelihood in water distribution and storage systems - Part 2: Influencing factors for copper and copper alloys |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| I.S. EN ISO 9455-6:1997 | SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT |
| ISO 9455-13:2017 | Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering |
| BS EN ISO 9455-15:2017 | Soft soldering fluxes. Test methods Copper corrosion test |
| IEC 61190-1-3:2017 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| I.S. EN IEC 61190-1-3:2018 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| ISO 9455-11:2017 | Soft soldering fluxes — Test methods — Part 11: Solubility of flux residues |
| I.S. EN 61190-1-3:2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| DIN EN ISO 9455-3:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS |
| DIN EN ISO 9455-10:2013-01 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| DIN EN ISO 9455-16:2013-08 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| DIN EN 14868:2005-11 | PROTECTION OF METALLIC MATERIALS AGAINST CORROSION - GUIDANCE ON THE ASSESSMENT OF CORROSION LIKELIHOOD IN CLOSED WATER CIRCULATION SYSTEMS |
| UNE-EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
| BS EN ISO 9455-6:1997 | Soft soldering fluxes. Test methods Determination and detection of halide (excluding fluoride) content |
| I.S. EN ISO 9454-2:2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| I.S. EN ISO 9455-9:1996 | SOFT SOLDERING FLUXES - TEST METHODS - PART 9: DETERMINATION OF AMMONIA CONTENT |
| I.S. EN ISO 9455-12:1995 | SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST |
| BS EN ISO 9455-13:2017 | Soft soldering fluxes. Test methods Determination of flux spattering |
| 15/30318681 DC : 0 | BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| NF ISO 26842-1 : 2009 | ADHESIVES - TEST METHODS FOR THE EVALUATION AND SELECTION OF ADHESIVES FOR INDOOR WOOD PRODUCTS - PART 1: RESISTANCE TO DELAMINATION IN NON-SEVERE ENVIRONMENTS |
| UNI EN 806-4 : 2010 | SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION |
| BS EN 806-4:2010 | Specifications for installations inside buildings conveying water for human consumption Installation |
| BS EN ISO 9455-5:2014 | Soft soldering fluxes. Test methods Copper mirror test |
| BS EN 61190-1-3 : 2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| PREN ISO 9455-10 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| UNE-EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| BS EN ISO 9455-17:2006 | Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| EN ISO 9455-9:1995 | Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:1993) |
| EN ISO 9455-5:2014 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| EN ISO 9455-12:1994 | Soft soldering fluxes - Test methods - Part 12: Steel tube corrosion test (ISO 9455-12:1992) |
| UNI EN ISO 9455-10 : 2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| BS EN 61190-1-1:2002 | Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| BS EN ISO 9455-11:2017 | Soft soldering fluxes. Test methods Solubility of flux residues |
| 05/30133287 DC : DRAFT MAY 2005 | IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| UNI EN ISO 9455-5 : 2014 | SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST |
| I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
| EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
| I.S. EN ISO 9455-5:2014 | SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
| I.S. EN ISO 9455-15:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017) |
| I.S. EN ISO 9455-13:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 13: DETERMINATION OF FLUX SPATTERING (ISO 9455-13:2017) |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
| I.S. EN 806-4:2010 | SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| DIN EN ISO 9455-9:1995-11 | Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:1993); German version EN ISO 9455-9:1995 |
| DIN EN ISO 9455-2:1995-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
| DIN EN ISO 9455-6:1997-03 | Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995); German version EN ISO 9455-6:1997 |
| BS EN 14868:2005 | Protection of metallic materials against corrosion. Guidance on the assessment of corrosion likelihood in closed water circulation systems |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 12224-3:2003 | Solder wire, solid and flux cored Specifications and test methods Part 3: Wetting balance test method for flux cored solder wire efficacy |
| BS EN ISO 12224-3:2003 | Solder wire, solid and flux cored. Specification and test methods Wetting balance test method for flux core solder wire efficacy |
| BS EN 12502-2:2004 | Protection of metallic materials against corrosion. Guidance on the assessment of corrosion likelihood in water distribution and storage systems Influencing factors for copper and copper alloys |
| ONORM EN ISO 9455-16 : 2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| ISO 9455-9:1993 | Soft soldering fluxes Test methods Part 9: Determination of ammonia content |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| BS EN 29455-11:1993 | Soft soldering fluxes. Test methods Solubility of flux residues |
| ISO 9455-17:2002 | Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
| ISO 9455-5:2014 | Soft soldering fluxes Test methods Part 5: Copper mirror test |
| ISO 9455-12:1992 | Soft soldering fluxes Test methods Part 12: Steel tube corrosion test |
| BS EN ISO 9455-10:2012 | Soft soldering fluxes. Test methods Flux efficacy test, solder spread method |
| BS EN 29455-5:1993 | Soft soldering fluxes. Test methods Copper mirror test |
| EN ISO 12224-1:1998 | Solder wire, solid and flux cored - Specification and test methods - Part 1: Classification and performance requirements (ISO 12224-1:1997) |
| EN 14868:2005 | Protection of metallic materials against corrosion - Guidance on the assessment of corrosion likelihood in closed water circulation systems |
| EN ISO 9455-2:1995 | Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993) |
| EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| EN 29455-5:1993 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:1992) |
| EN 806-4:2010 | Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation |
| EN ISO 9455-6:1997 | Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995) |
| EN ISO 9455-17:2006 | Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
| EN 29455-8:1993 | Soft soldering fluxes - Test methods - Part 8: Determination of zinc content (ISO 9455-8:1991) |
| EN ISO 12224-3:2003 | Solder wire, solid and flux cored - Specifications and tests methods - Part 3: Wetting balance test method for flux core solder wire efficacy (ISO 12224-3:2003) |
| EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
| BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| 16/30337159 DC : 0 | BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST |
| BS ISO 9455-17 : 2002 AMD 16425 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| UNE-EN ISO 9455-5:2015 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| DIN EN ISO 9455-5:2014-10 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| 11/30213136 DC : 0 | BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| 11/30234673 DC : 0 | BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| EN IEC 61190-1-3:2018 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| UNE-EN ISO 9455-13:2018 | Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017) |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN ISO 9455-15:2017 | Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017) |
| ISO 9455-15:2017 | Soft soldering fluxes — Test methods — Part 15: Copper corrosion test |
| I.S. EN 61190-1-1:2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| DIN EN ISO 12224-3:2003-10 | Solder wire, solid and flux cored - Specifications and test methods - Part 3: Wetting balance test method for flux cored solder wire efficacy (ISO 12224-3:2003) |
| DIN EN ISO 12224-1:1998-10 | Solder wire, solid and flux cored - Specification and test method - Part 1: Classification and performance requirements (ISO 12224-1:1997) |
| BS EN 29455-1:1994 | Soft soldering fluxes. Test methods Determination of non-volatile matter, gravimetric method |
| BS EN 29455-8:1993 | Soft soldering fluxes. Test methods Determination of zinc content |
| ISO 9455-16:2013 | Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| DIN EN ISO 9455-12:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| I.S. EN ISO 9455-17:2006 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| I.S. EN ISO 12224-1:1999 | SOLDER WIRE, SOLID AND FLUX CORED - SPECIFICATION AND TEST METHODS - CLASSIFICATION AND PERFORMANCE REQUIREMENTS |
| ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
| ISO 9455-11:2017 | Soft soldering fluxes — Test methods — Part 11: Solubility of flux residues |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 9455-9:1993 | Soft soldering fluxes Test methods Part 9: Determination of ammonia content |
| ISO 9455-3:1992 | Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods |
| ISO 9455-8:1991 | Soft soldering fluxes — Test methods — Part 8: Determination of zinc content |
| ISO 9455-16:2013 | Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
| ISO 9455-14:2017 | Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues |
| ISO 9455-13:2017 | Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering |
| ISO 9455-5:2014 | Soft soldering fluxes Test methods Part 5: Copper mirror test |
| ISO 9455-6:1995 | Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content |
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