IPC WP 009 : 0
Current
The latest, up-to-date edition.
A SUMMARY OF TIN WHISKER RESEARCH REFERENCES
Hardcopy
English
05-14-2009
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List of Figures
Summary Bibliography of Papers
Overview of Papers
Conclusions
Specifies the concern over tin whiskers as a reliability hazard that has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries.
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC JP002 : 0 | JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE |
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