IPC WP 006 : 2003
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
ROUND ROBIN TESTING AND ANALYSIS - LEAD-FREE ALLOYS - TIN, SILVER AND COPPER
09-13-2023
11-23-2012
MISSION STATEMENT
SOLDER PRODUCTS VALUE COUNCIL MEMBERS
Introduction and Statement of Problem
Methodology
Alloy Choice
Test Regimen for Alloy Comparison
Assembly Performance Comparison
Assembly Performance Testing: Statistical Procedures Used
Examples of Statistical Analysis
Conclusions Based on Assembly Performance Testing
LONG TERM RELIABILITY COMPARISON
Third Party Solder Paste Testing
Test Vehicle Assembly
Inspection, Test, Repair, and Data Logging
Long Term Thermal Cycling
Periodic Metallographic Analysis
Data Analysis
Appendix 1 - Data Tables of Testing Participants
Appendix 2 - IPC-TM-650, 2.4.14.2 Liquid Flux Activity
Wetting Balance Method, Using Flux Defined
in J-STD-003A, 3.2.2
Appendix 3 - IPC-TM-650, 2.4.46, Spread Test, Liquid or
Extracted Solder Flux, Solder Paste and
Extracted Cored Wires or Preforms
Describes round robin test program on the assembly properties of three lead free solder alloys.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| IPC SPVC2005-CD : 2005 | ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IPC SPVC2005-CD : 2005 | ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER |
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