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IPC TR 486 : 0

Current

Current

The latest, up-to-date edition.

ROUND ROBIN STUDY TO CORRELATE IST AND MICROSECTIONING EVALUATIONS FOR INNER-LAYER SEPARATION

Available format(s)

Hardcopy

Language(s)

English

Published date

07-01-2001

Provides full detail of the round study charged with assessing the use of IST as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes.

DevelopmentNote
Included in IPC C 105 & IPC C 1000. (08/2008)
DocumentType
Standard
Pages
15
PublisherName
Institute of Printed Circuits
Status
Current

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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