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IPC TR 484 : 1986

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY

Withdrawn date

09-13-2023

Published date

11-23-2012

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1.0 Introduction
1.1 Objectives and scope
1.2 Background
2.0 Round robin test program
3.0 Round robin results - phase I
3.1 Thickness measurements
3.2 Test mandrel selection
3.3 Tensile properties
3.4 Grain structure
4.0 Recommendations - phase I
5.0 Copper foil fatigue behavior and cyclic life
     predictions
6.0 Round robing results - phase II
6.1 Standard electrodeposited copper foil, CF-E1
6.2 High-ductility electrodeposited copper foil, CF-E2
6.3 High temperature ductility electrodeposited copper
     foil CF-E3
6.4 Annealed electrodeposited copper foil, CF-E4
6.5 As-rolled wrought copper foil, CF-W5
6.6 Annealed wrought copper foil, CF-W7
6.7 Low temperature annealable wrought copper foil,
     CF-W8
6.8 Ductility results from 40-mil diameter test
     mandrels
7.0 Miscellaneous observations
8.0 Summary, conclusions and recommendations
8.1 Conclusions
8.2 Recommendations
References
Appendices
A IPC test plan for copper foil ductility round robin
B IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
     Fatigue and Ductility, Foil", August 1980
C Operating instructions for fatigue ductility flex
     tester
D Data sheet sample
E IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
     Fatigue and Ductility, Foil," Revision A, December
     1983
Figures
1 Means, standard deviations and ranges of measured
     gauge thicknesses of wrought and electrodeposited
     copper foil samples normalized relative to means
     from test lab A
2 Means, standard deviations and ranges of measured
     gauge and core thicknesses of electrodeposited
     copper foil samples normalized relative to means
     from test lab A
3 Photomicrographic cross-section of 2 oz./ft2
     electrodeposited copper foil sample
4 Means of measured gauge and plating tooth/adhesion
     treatment thicknesses differentiated by foil weight
     and vendor
5 Manson-Coffin plot (cyclic strain range vs. fatigue
     life) showing contributions of elastic and plastic
     strains and deviation at extremely low-cycle
     fatigue
6 Manson-Coffin plot of a CF-E3-2-S(XM) copper foil
     sample showing fatigue data ranging from 4.0 to
     185,00 cycles-to-failure superimposed on fatigue
     curve predicted from tensile properties
7 Manson-Coffin plot of predicted and experimental
     fatigue behavior of CF-E1-1-S and CF-E4-1-S copper
     foil samples
8 Manson-Coffin plot of predicted and experimental
     fatigue behavior of CF-W5-1-S and CF-W7-1-S copper
     foil samples
9 Manson-Coffin plot of predicted and experimental
     fatigue behavior of CF-E1-1-S and CF-W5-1-S copper
     foil samples
10 Ductility results for standard electrodeposited
     copper foil, CF-E1, for various foil weights and
     foil vendors
11 Ductility results for high-ductility
     electrodeposited copper foil, CF-E2, for various
     foil weights and foil vendors
12 Ductility results for high temperature ductility
     electrodeposited copper foil, CF-E3, for various
     foil weights and foil vendors
13 Ductility results for annealed electrodeposited
     copper foil, CF-E4, for various foil weights and
     foil vendors
14 Ductility results for as-rolled wrought copper
     foil, CF-W5, for various foil weights and foil
     vendors
15 Ductility results for annealed wrought copper
     foil, CF-W7, for various foil weights and foil
     vendors
16 Ductility results for low temperature annealable
     wrought copper foil, CF-W8, before and after
     annealing for various foil weights and foil vendors
Tables
1 Copper foil sample distribution for ductility round
     robin study
2 Tensile strengths of the copper foil samples
     submitted for the ductility round robin study
3 Proposed and established minimum ductility
     requirements for IPC Standard ANSI/IPC-CF-150
4 Comparison of fatigue lives and ductility results
     from tests with 79-, 62- and 40-mil diameter
     mandrels

Determines ductility of the foils provided by the industry's copper foil vendors.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn

IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
IPC TR 482 : 1976 NEW DEVELOPMENTS IN THIN COPPER FOILS
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC 4562 CHINESE : A METAL FOIL FOR PRINTED BOARD APPLICATIONS

IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC TR 482 : 1976 NEW DEVELOPMENTS IN THIN COPPER FOILS
IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS

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