IPC TR 484 : 1986
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
09-13-2023
11-23-2012
1.0 Introduction
1.1 Objectives and scope
1.2 Background
2.0 Round robin test program
3.0 Round robin results - phase I
3.1 Thickness measurements
3.2 Test mandrel selection
3.3 Tensile properties
3.4 Grain structure
4.0 Recommendations - phase I
5.0 Copper foil fatigue behavior and cyclic life
predictions
6.0 Round robing results - phase II
6.1 Standard electrodeposited copper foil, CF-E1
6.2 High-ductility electrodeposited copper foil, CF-E2
6.3 High temperature ductility electrodeposited copper
foil CF-E3
6.4 Annealed electrodeposited copper foil, CF-E4
6.5 As-rolled wrought copper foil, CF-W5
6.6 Annealed wrought copper foil, CF-W7
6.7 Low temperature annealable wrought copper foil,
CF-W8
6.8 Ductility results from 40-mil diameter test
mandrels
7.0 Miscellaneous observations
8.0 Summary, conclusions and recommendations
8.1 Conclusions
8.2 Recommendations
References
Appendices
A IPC test plan for copper foil ductility round robin
B IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
Fatigue and Ductility, Foil", August 1980
C Operating instructions for fatigue ductility flex
tester
D Data sheet sample
E IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
Fatigue and Ductility, Foil," Revision A, December
1983
Figures
1 Means, standard deviations and ranges of measured
gauge thicknesses of wrought and electrodeposited
copper foil samples normalized relative to means
from test lab A
2 Means, standard deviations and ranges of measured
gauge and core thicknesses of electrodeposited
copper foil samples normalized relative to means
from test lab A
3 Photomicrographic cross-section of 2 oz./ft2
electrodeposited copper foil sample
4 Means of measured gauge and plating tooth/adhesion
treatment thicknesses differentiated by foil weight
and vendor
5 Manson-Coffin plot (cyclic strain range vs. fatigue
life) showing contributions of elastic and plastic
strains and deviation at extremely low-cycle
fatigue
6 Manson-Coffin plot of a CF-E3-2-S(XM) copper foil
sample showing fatigue data ranging from 4.0 to
185,00 cycles-to-failure superimposed on fatigue
curve predicted from tensile properties
7 Manson-Coffin plot of predicted and experimental
fatigue behavior of CF-E1-1-S and CF-E4-1-S copper
foil samples
8 Manson-Coffin plot of predicted and experimental
fatigue behavior of CF-W5-1-S and CF-W7-1-S copper
foil samples
9 Manson-Coffin plot of predicted and experimental
fatigue behavior of CF-E1-1-S and CF-W5-1-S copper
foil samples
10 Ductility results for standard electrodeposited
copper foil, CF-E1, for various foil weights and
foil vendors
11 Ductility results for high-ductility
electrodeposited copper foil, CF-E2, for various
foil weights and foil vendors
12 Ductility results for high temperature ductility
electrodeposited copper foil, CF-E3, for various
foil weights and foil vendors
13 Ductility results for annealed electrodeposited
copper foil, CF-E4, for various foil weights and
foil vendors
14 Ductility results for as-rolled wrought copper
foil, CF-W5, for various foil weights and foil
vendors
15 Ductility results for annealed wrought copper
foil, CF-W7, for various foil weights and foil
vendors
16 Ductility results for low temperature annealable
wrought copper foil, CF-W8, before and after
annealing for various foil weights and foil vendors
Tables
1 Copper foil sample distribution for ductility round
robin study
2 Tensile strengths of the copper foil samples
submitted for the ductility round robin study
3 Proposed and established minimum ductility
requirements for IPC Standard ANSI/IPC-CF-150
4 Comparison of fatigue lives and ductility results
from tests with 79-, 62- and 40-mil diameter
mandrels
Determines ductility of the foils provided by the industry's copper foil vendors.
DocumentType |
Standard
|
PublisherName |
Institute of Printed Circuits
|
Status |
Withdrawn
|
IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
IPC TR 482 : 1976 | NEW DEVELOPMENTS IN THIN COPPER FOILS |
IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
IPC 4562 CHINESE : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
IPC TR 482 : 1976 | NEW DEVELOPMENTS IN THIN COPPER FOILS |
IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
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