IPC QL 653 : A
Current
The latest, up-to-date edition.
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
Hardcopy
English
11-01-1997
1.0 SCOPE
1.1 Scope
1.2 Purpose
2.0 APPLICABLE DOCUMENTS
2.1 Institute for Interconnecting and Packaging
Electronic Circuits (IPC)
2.2 National Conference of Standards Laboratories
2.2.1 ANSI/NCSL 540-1-1994
2.3 Order Of Precedence
3.0 REQUIREMENTS
3.1 Terms and Definitions
3.1.1 Inspection/Test Personnel
3.1.2 Inspection/Test Facility
3.1.3 Certifying Agency
3.2 Certification
3.3 Inspection/Test Program
3.4 Documentation
3.4.1 Documentation Submission
3.4.2 Documentation at the Facility
3.5 System Implementation
3.5.1 Inspection/Test Personnel Certification
3.5.2 Calibration
3.5.3 Description of Inspection/Test Procedures
and Controls
3.5.4 Traceability
3.5.5 Handling Procedures
3.5.6 Controlled Storage Area
3.5.7 Inspection/Test Facility's Internal
Audit Activities
3.5.8 Inspection/Test Reports
3.5.9 Record Retention
3.5.10 Safety Operating Procedures
3.6 Certifying Agency Accessibility
3.6.1 Confidentiality
4.0 QUALITY ASSURANCE PROVISIONS
4.1 Inspection/Test Conditions
4.2 Certification Approval
4.2.1 Documentation Submission
4.2.2 Documentation Review
4.2.3 Audit
4.2.4 Notification of Audit Results
4.2.5 Corrective Action
4.3 Extent of Certification
4.3.1 Additional Inspection/Test Capability
4.4 Retention of Certification.
4.4.1 Changes
4.4.2 Inspection/Test Facility Internal Audits
4.5 Re-certification
5.0 PACKAGING
6.0 NOTES
6.1 General
6.2 Organizational Structure
6.3 Handbook for the Interpretation and Application
of ANSI/NCSL 540-1-1994
6.4 Subject (Key Word) Listing
APPENDIX A
APPENDIX B
APPENDIX C
APPENDIX D
APPENDIX E
Establishes the qualification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluation or auditing a technically oriented inspection/testing facility.
DocumentType |
Standard
|
Pages |
52
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
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13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
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NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
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IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
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