IPC ML 950 : C1980
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
Superseded date
07-23-2013
Superseded by
Published date
11-23-2012
Publisher
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Describes qualification and performance of rigid multilayer printed boards with plated-through holes. Circuitry may be bare copper, metallic overplated or coated, fused, unfused, leveled etc.
| DevelopmentNote |
Supersedes IPC ML 910. (03/2002)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC D 300 : G1984 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC L 125 : A | PLASTIC SUBSTRATES, CLAD OR UNCLAD, FOR HIGH SPEED/HIGH FREQUENCY INTERCONNECTIONS |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC L 112 : A92 | SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
| IPC L 130 : 1977 | SPECIFICATION FOR THIN LAMINATES, METAL-CLAD, PRIMARILY FOR GENERAL PURPOSE MULTILAYER PRINTED BOARDS |
| IPC FC 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
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