IPC J STD 035 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
Hardcopy
03-11-2023
English
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1 SCOPE
2 DEFINITIONS
2.1 A-mode
2.2 B-mode
2.3 Back-Side Substrate View Area
2.4 C-mode
2.5 Through Transmission Mode
2.6 Die Attach View Area
2.7 Die Surface View Area
2.8 Focal Length (FL)
2.9 Focus Plane
2.10 Leadframe (L/F) View Area
2.11 Reflective Acoustic Microscope
2.12 Through Transmission Acoustic Microscope
2.13 Time-of-Flight (TOF)
2.14 Top-Side Die Attach Substrate View Area
3 APPARATUS
3.1 Reflective Acoustic Microscope System
3.2 Through Transmission Acoustic Microscope System
4 PROCEDURE
4.1 Equipment Setup
4.2 Perform Acoustic Scans
Appendix A Acoustic Microscopy Defect Check Sheet
Appendix B Potential Image Pitfalls
Appendix C Some Limitations of Acoustic Microscopy
Appendix D Reference Procedure for Presenting Applicable
Scanned Data
Specifies methods for performing acoustic microscopy on nonhermetic encapsulated electronic components. Gives to users with an acoustic microscopy process flow for detection of defects non-destructively in plastic packages, while achieving reproducibility.
| Committee |
TC 47
|
| DevelopmentNote |
Jointly published by IPC & JEDEC. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC PAS 62191:2000 | Identical |
| SAE AS 6294/1 : 2017 | REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS |
| SAE AS 6294/2 : 2018 | REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS |
| IEC PAS 62190:2000 | Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices |
| SAE AS 6171/6 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS |
| IEC PAS 62686-1:2011 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IPC J STD 020 CHINESE : D-1 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| DD IEC PAS 62686-1 : DRAFT JULY 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| MIL-PRF-38534 Revision K:2017 | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
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