IPC J STD 030 : A
Current
The latest, up-to-date edition.
SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
Hardcopy
English
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1 SCOPE
2 APPLICABLE DOCUMENTS
3 TERMS AND DEFINITIONS
4 BACKGROUND
5 MECHANICAL CONSIDERATIONS
6 UNCURED UNDERFILL CHARACTERISTICS
7 MATERIALS PACKAGING, HANDLING, AND STORAGE
8 APPLICATION PROCESS
9 CURE PROCESS
10 CURED UNDERFILL CHARACTERISTICS
11 WORKMANSHIP
12 PROCESS RELIABILITY ASSESSMENT
13 OTHER CONSIDERATIONS
14 TROUBLE SHOOTING
Gives users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second level interconnects.
| Committee |
5-20
|
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ASTM D 2471 : 1999 | Standard Test Method for Gel Time and Peak Exothermic Temperature of Reacting Thermosetting Resins (Withdrawn 2008) |
| ASTM D 792 : 2013 : REDLINE | Standard Test Methods for Density and Specific Gravity (Relative Density) of Plastics by Displacement |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC 9201 : A | SURFACE INSULATION RESISTANCE HANDBOOK |
| ASTM D 257 : 2014 : REDLINE | Standard Test Methods for DC Resistance or Conductance of Insulating Materials |
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