IPC-9701B:2022
Current
Current
The latest, up-to-date edition.
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Available format(s)
Hardcopy
Language(s)
English
Published date
02-01-2022
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies.
| DocumentType |
Test Method
|
| ISBN |
978-1-63816-072-4
|
| Pages |
24
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| JEDEC JESD 22-B113B:2018 | Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products |
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