IPC 9202 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
Hardcopy
11-15-2022
English
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1 Scope/Introduction
2 APPLICABLE DOCUMENTS
3 TEST SPECIMENS
4 SAMPLE SIZES
5 APPARATUS AND MATERIALS
6 PROCESSING OF TEST VEHICLES
7 SPECIMEN PREPARATION FOR TESTING
8 TEST METHODOLOGY
9 ACCEPTANCE CRITERIA
10 REPORTING
11 NOTES
12 HELPFUL REFERENCES
Explains changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.
| DevelopmentNote |
Included in IPC C 103, IPC C 108 & IPC C 1000. (11/2011)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 9203 : 0 | USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| NASA GSFC STD 8002 : 2015 | STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC A 52-G : 2006 | CLEANLINESS AND RESIDUE EVALUATION TEST BOARD |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC A 24 : LATEST | SURFACE INSULATION RESISTANCE |
| IPC 9201 : A | SURFACE INSULATION RESISTANCE HANDBOOK |
| IPC WP 008 : 0 | SETTING UP ION CHROMATOGRAPHY CAPABILITY |
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