IPC 6016 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS
Hardcopy
09-01-2015
English
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1 SCOPE
1.1 Purpose
1.2 Performance Classification
1.3 Slash Sheet Categories
1.4 Documentation Hierarchy
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
3 REQUIREMENTS
3.1 General
3.2 Materials
3.3 Visual Examination
3.4 Dimensional Requirements
3.5 Conductor Definition
3.6 Structural Integrity
3.7 Other Tests
3.8 Solder Resist (Solder Mask) Requirements
3.9 Electrical Properties
3.10 Environmental
3.11 Special Requirements
3.12 Repair
4 QUALITY ASSURANCE
4.1 General
Appendix A
Gives specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers.
| DevelopmentNote |
To be used with IPC 6011 and IPC 6012. (03/2002) Included in IPC 6010 SERIES. (09/2003) Also available in CD-ROM format. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC 4553 CHINESE : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
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