IPC 6015 : 0
Current
The latest, up-to-date edition.
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
Hardcopy
English
02-01-1998
1.0 SCOPE
1.1 Scope
1.2 Purpose
1.3 Performance Classification
1.4 Documentation Hierarchy
2.0 APPLICABLE DOCUMENTS
2.1 Mandatory Documents
2.2 Supplemental Documents
3.0 REQUIREMENTS
3.1 General
3.2 Materials Used in this Specification
3.3 Visual Examination
3.4 Dimensional Requirements
3.5 Conductor Definition
3.6 Structural Integrity Prior to Stress
3.7 Structural Integrity After Thermal Stress
3.8 Solder Resist (Solder Mask) Requirements
3.9 Electrical Properties
3.10 Environmental
3.11 Special Requirements
3.12 Repair
4.0 QUALITY ASSURANCE
4.1 General
4.2 Quality Conformance Inspection
Figures
Tables
Visual requirements for organic substrates used to interconnect chip components, specifically single-chip modules and multi-chip modules (MCM-L). This standard covers quality and reliability requirements for plating, conductors, structural integrity, electrical properties, insulation resistance, and more. Includes test methods.
| DevelopmentNote |
Supersedes IPC RF 245. (12/2001) To be used with IPC 6011. (06/2002) Included in IPC 6010 SERIES. (09/2003)
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IPC 2225 : 0 | SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC MC 790 : 0 | GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION |
| IPC PE 740 : 0 | TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
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