IPC 4202 : A
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
Hardcopy
03-10-2022
Important note : All end users must be registered with an Account prior to user licenses being assigned.
1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
Sets up the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed boards.
| Committee |
D-10
|
| DevelopmentNote |
Supersedes IPC FC 231. (06/2002) Included in IPC C 102 & IPC C 1000. (03/2010) A2010 Edition is still available in Chinese Language, See IPC 4202 CHINESE. B2016 Edition released in March 2017. (04/2017) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
51
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2223 CHINESE : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 4204 CHINESE : A2011 AMD 1 2013 | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC 4412 : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 2223 GERMAN : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC FLXCSP0605-CD : 2005 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION |
| IPC 4412 CHINESE : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| IPC FLXCSP0706-CD : 2006 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| I.S. EN 16602-70-12:2016 | SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.