IPC 2315 : 0
Current
Current
The latest, up-to-date edition.
DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS
Available format(s)
Hardcopy
Language(s)
English
Published date
06-01-2000
Publisher
Excluding Tax where applicable
Published jointly with the Japan Printed Circuit Association, this document gives an easy to follow tutorial on the selection of HDI and microvia design structures and rules.
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
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