IPC 2224 : 0
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS
05-22-2016
1.0 SCOPE
1.1 Purpose
1.2 Documentation Hierarchy
1.3 Presentation
1.4 Interpretation
1.5 Classification of Products
2.0 APPLICABLE DOCUMENTS
2.1 Reference Documents
3.0 GENERAL REQUIREMENTS
3.1 Test Requirement Considerations
4.0 MATERIALS
4.1 Material Selection
4.2 Bonding Material
4.3 Laminate Materials
4.4 Flexible Substrates
4.5 Conductive Materials
4.6 Organic Protective Coatings
4.7 Marking and Legends
4.8 Thickness Class Tolerance
5.0 MECHANICAL/PHYSICAL PROPERTIES
5.1 Fabrication Requirements
5.2 Product/Board Configuration
5.3 Assembly Requirements
5.4 Dimensioning Systems
5.5 Structural Strength
6.0 ELECTRICAL PROPERTIES
7.0 THERMAL MANAGEMENT
7.1 Convection
7.2 Heat Dissipation Considerations
8.0 COMPONENT AND ASSEMBLY ISSUES
8.1 General Placement Requirements
8.2 Plated-Through Hole Requirements
8.3 Mounting Methods for Connectors
8.4 Stiffeners
8.5 Fine Pitch SMT (Peripherals)
8.6 Array SMT (BGA, ?BGA, etc.)
8.7 Bare Die
8.8 Tape Automated Bonding
8.9 Castellations
8.10 Bottom Only Terminations
9.0 HOLES/INTERCONNECTIONS
9.1 General Requirements for Lands with Holes
9.2 Holes
9.3 Drill Size Recommendations for Printed
Boards
10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS
10.1 Conductor Characteristics
10.2 Land Characteristics
11.0 DOCUMENTATION
11.1 Artwork
12.0 QUALITY ASSURANCE
Figures
Tables
Establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be reinforced, homogeneous, or used in combination with inorganic materials; interconnections may be single, double or multilayered.
| DevelopmentNote |
To be used in conjunction with IPC 2221. (06/2002) Included in IPC 2220 Series. Also available in CD-ROM format. (09/2005)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 2141 : A | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC D 317 : A1995 | DESIGN GUIDELINES FOR ELECTRONIC PACKAGING UTILIZING HIGH SPEED TECHNIQUES |
| IPC D 316 : 1995 | HIGH FREQUENCY DESIGN GUIDE |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
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